FT27C256R-12KI datasheet, PDF - EEWORLD Datasheet

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FT27C256R-12KI: DescriptionUVPROM, 32KX8, 120ns, CMOS, CQCC32; Categorystorage storage; File Size570KB，10 Pages; ManufacturerForce Technologies Ltd.

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FT27C256R-12KI Overview

UVPROM, 32KX8, 120ns, CMOS, CQCC32

FT27C256R-12KI Parametric

Parameter Name	Attribute value
Maker	Force Technologies Ltd.
package instruction	QCCJ, LDCC32,.5X.6
Reach Compliance Code	compli
Maximum access time	120 ns
I/O type	COMMON
JESD-30 code	R-XQCC-J32
memory density	262144 bi
Memory IC Type	UVPROM
memory width	8
Number of terminals	32
word count	32768 words
character code	32000
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	32KX8
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC32,.5X.6
Package shape	RECTANGULAR
Package form	CHIP CARRIER
power supply	5/6.5 V
Programming voltage	13 V
Certification status	Not Qualified
Maximum slew rate	0.025 mA
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD

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FT27C256R-12KI Related Products

	FT27C256R-12KI	FT27C256R-20KM	FT27C256R-20KI	FT27C256R-70KC
Description	UVPROM, 32KX8, 120ns, CMOS, CQCC32	UVPROM, 32KX8, 200ns, CMOS, CQCC32	UVPROM, 32KX8, 200ns, CMOS, CQCC32	UVPROM, 32KX8, 70ns, CMOS, CQCC32
Maker	Force Technologies Ltd.	Force Technologies Ltd.	Force Technologies Ltd.	Force Technologies Ltd.
package instruction	QCCJ, LDCC32,.5X.6	QCCJ, LDCC32,.5X.6	QCCJ, LDCC32,.5X.6	QCCJ, LDCC32,.5X.6
Reach Compliance Code	compli	compliant	compli	compli
Maximum access time	120 ns	200 ns	200 ns	70 ns
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XQCC-J32	R-XQCC-J32	R-XQCC-J32	R-XQCC-J32
memory density	262144 bi	262144 bit	262144 bi	262144 bi
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM
memory width	8	8	8	8
Number of terminals	32	32	32	32
word count	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000
Maximum operating temperature	85 °C	125 °C	85 °C	70 °C
Minimum operating temperature	-40 °C	-55 °C	-40 °C	-
organize	32KX8	32KX8	32KX8	32KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	QCCJ	QCCJ	QCCJ	QCCJ
Encapsulate equivalent code	LDCC32,.5X.6	LDCC32,.5X.6	LDCC32,.5X.6	LDCC32,.5X.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
power supply	5/6.5 V	5/6.5 V	5/6.5 V	5/6.5 V
Programming voltage	13 V	13 V	13 V	13 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	0.025 mA	0.025 mA	0.025 mA	0.025 mA
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	MILITARY	INDUSTRIAL	COMMERCIAL
Terminal form	J BEND	J BEND	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD

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