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Datasheet> All Categories > storage> storage> FT27C256R-20KI
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FT27C256R-20KI

Description
UVPROM, 32KX8, 200ns, CMOS, CQCC32
Categorystorage    storage   
File Size570KB，10 Pages
ManufacturerForce Technologies Ltd.
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FT27C256R-20KI Overview

UVPROM, 32KX8, 200ns, CMOS, CQCC32

FT27C256R-20KI Parametric

Parameter NameAttribute value
MakerForce Technologies Ltd.
package instructionQCCJ, LDCC32,.5X.6
Reach Compliance Codecompli
Maximum access time200 ns
I/O typeCOMMON
JESD-30 codeR-XQCC-J32
memory density262144 bi
Memory IC TypeUVPROM
memory width8
Number of terminals32
word count32768 words
character code32000
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize32KX8
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC32,.5X.6
Package shapeRECTANGULAR
Package formCHIP CARRIER
power supply5/6.5 V
Programming voltage13 V
Certification statusNot Qualified
Maximum slew rate0.025 mA
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD

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FT27C256R-20KI Related Products

FT27C256R-20KI FT27C256R-20KM FT27C256R-12KI FT27C256R-70KC
Description UVPROM, 32KX8, 200ns, CMOS, CQCC32 UVPROM, 32KX8, 200ns, CMOS, CQCC32 UVPROM, 32KX8, 120ns, CMOS, CQCC32 UVPROM, 32KX8, 70ns, CMOS, CQCC32
Maker Force Technologies Ltd. Force Technologies Ltd. Force Technologies Ltd. Force Technologies Ltd.
package instruction QCCJ, LDCC32,.5X.6 QCCJ, LDCC32,.5X.6 QCCJ, LDCC32,.5X.6 QCCJ, LDCC32,.5X.6
Reach Compliance Code compli compliant compli compli
Maximum access time 200 ns 200 ns 120 ns 70 ns
I/O type COMMON COMMON COMMON COMMON
JESD-30 code R-XQCC-J32 R-XQCC-J32 R-XQCC-J32 R-XQCC-J32
memory density 262144 bi 262144 bit 262144 bi 262144 bi
Memory IC Type UVPROM UVPROM UVPROM UVPROM
memory width 8 8 8 8
Number of terminals 32 32 32 32
word count 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000
Maximum operating temperature 85 °C 125 °C 85 °C 70 °C
Minimum operating temperature -40 °C -55 °C -40 °C -
organize 32KX8 32KX8 32KX8 32KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code QCCJ QCCJ QCCJ QCCJ
Encapsulate equivalent code LDCC32,.5X.6 LDCC32,.5X.6 LDCC32,.5X.6 LDCC32,.5X.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER
power supply 5/6.5 V 5/6.5 V 5/6.5 V 5/6.5 V
Programming voltage 13 V 13 V 13 V 13 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 0.025 mA 0.025 mA 0.025 mA 0.025 mA
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL MILITARY INDUSTRIAL COMMERCIAL
Terminal form J BEND J BEND J BEND J BEND
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD QUAD QUAD QUAD

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