UVPROM, 32KX8, 200ns, CMOS, CQCC32
| Parameter Name | Attribute value |
| Maker | Force Technologies Ltd. |
| package instruction | QCCJ, LDCC32,.5X.6 |
| Reach Compliance Code | compliant |
| Maximum access time | 200 ns |
| I/O type | COMMON |
| JESD-30 code | R-XQCC-J32 |
| memory density | 262144 bit |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of terminals | 32 |
| word count | 32768 words |
| character code | 32000 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 32KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC32,.5X.6 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| power supply | 5/6.5 V |
| Programming voltage | 13 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.0002 A |
| Maximum slew rate | 0.025 mA |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |

| FT27C256R-20KM | FT27C256R-12KI | FT27C256R-20KI | FT27C256R-70KC | |
|---|---|---|---|---|
| Description | UVPROM, 32KX8, 200ns, CMOS, CQCC32 | UVPROM, 32KX8, 120ns, CMOS, CQCC32 | UVPROM, 32KX8, 200ns, CMOS, CQCC32 | UVPROM, 32KX8, 70ns, CMOS, CQCC32 |
| Maker | Force Technologies Ltd. | Force Technologies Ltd. | Force Technologies Ltd. | Force Technologies Ltd. |
| package instruction | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 |
| Reach Compliance Code | compliant | compli | compli | compli |
| Maximum access time | 200 ns | 120 ns | 200 ns | 70 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-XQCC-J32 | R-XQCC-J32 | R-XQCC-J32 | R-XQCC-J32 |
| memory density | 262144 bit | 262144 bi | 262144 bi | 262144 bi |
| Memory IC Type | UVPROM | UVPROM | UVPROM | UVPROM |
| memory width | 8 | 8 | 8 | 8 |
| Number of terminals | 32 | 32 | 32 | 32 |
| word count | 32768 words | 32768 words | 32768 words | 32768 words |
| character code | 32000 | 32000 | 32000 | 32000 |
| Maximum operating temperature | 125 °C | 85 °C | 85 °C | 70 °C |
| Minimum operating temperature | -55 °C | -40 °C | -40 °C | - |
| organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | QCCJ | QCCJ | QCCJ | QCCJ |
| Encapsulate equivalent code | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| power supply | 5/6.5 V | 5/6.5 V | 5/6.5 V | 5/6.5 V |
| Programming voltage | 13 V | 13 V | 13 V | 13 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA |
| surface mount | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| Terminal form | J BEND | J BEND | J BEND | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD |