BM62/64
Bluetooth
®
4.2 Stereo Audio Module
Features
• Qualified for Bluetooth v4.2 specifications
• Supports HFP 1.6, HSP 1.2, A2DP 1.3, SPP 1.2
and AVRCP 1.6
• Supports Bluetooth 4.2 dual-mode (BDR/EDR/
BLE) specifications (FW dependent)
• Stand-alone module with on-board PCB antenna
and Bluetooth stack
• Supports high resolution up to 24-bit, 96 kHz
audio data format
• Supports to connect two hosts with HFP/A2DP
profiles simultaneously
• Transparent UART mode for seamless serial data
over UART interface
• Supports virtual UART communication between
host MCU and smartphone applications by Blue-
tooth SPP or BLE link
• Easy to configure with Windows
®
GUI or directly
by external MCU
• Supports firmware field upgrade
• Supports one microphone
• Compact surface mount module:
- BM62: 29 x 15 x 2.5 mm
- BM64: 32 x 15 x 2.5 mm
• Castellated surface mount pads for easy and
reliable host PCB mounting
• RoHS compliant
• Ideal for portable battery operated devices
• Internal battery regulator circuitry
• Supports Serial Copy Management System
(SCMS-T) content protection
FIGURE 1:
BM62 MODULE
FIGURE 2:
BM64 MODULE
DSP Audio Processing
• Supports 64 kbps A-Law,
-Law PCM format/
Continuous Variable Slope Delta (CVSD) modula-
tion for SCO channel operation
• Supports 8/16 kHz noise suppression
• Supports 8/16 kHz echo cancellation
• Supports Modified Sub-Band Coding (MSBC) for
wide band speech
• Built-in High Definition Clean Audio (HCA) algo-
rithms for both narrow band and wide band
speech processing
• Packet loss concealment (PLC)
• Built-in audio effect algorithms to enhance audio
streaming
Audio Codec
• Sub-band Coding (SBC) and optional Advanced
Audio Coding (AAC) decoding
• 20-bit digital-to-analog converter (DAC) with
98 dB SNR
• 16-bit analog-to-digital converter (ADC) with
92 dB SNR
• Supports up to 24-bit, 96 kHz I
2
S digital audio
(BM64 only)
2016 Microchip Technology Inc.
Preliminary
DS60001403B-Page 1
BM62/64
Peripherals
• Built-in lithium-ion and lithium-polymer battery
charger (up to 350 mA)
• Integrated 1.8V and 3V configurable switching
regulator and low-dropout (LDO) regulator
• Built-in ADC for battery monitoring and voltage
sense
• Built-in ADC for charger thermal protection
• Built-in undervoltage protection (UVP)
• An AUX-In port for external audio input
• Two LED drivers
• Multiple I/O pins for control and status
Description
The BM62/64 Stereo Audio module is a fully qualified
Bluetooth 4.2 dual-mode (BDR/EDR/BLE) module for
designers to add wireless audio and voice applications
to their products. The BM62/64 module is a Bluetooth
Special Interest Group (SIG) certified module that
provides a complete wireless solution with Bluetooth
stack, integrated PCB antenna, and worldwide radio
certifications in a compact surface-mount package.
The BM62/64 module has several SKUs. The BM62
module is a Class 2 device and the BM64 module is
available in both Class 1 and Class 2 versions.
RF/Analog
• Frequency spectrum: 2.402 GHz to 2.480 GHz
• Receive sensitivity: -90 dBm (2 Mbps EDR)
• Output Power
- BM64 Class 1: +15 dBm typical
- BM62/64 Class 2: +2 dBm typical
HCI Interface
• High-speed HCI-UART interface (supports up to
921,600 bps)
MAC/Baseband Processor
• Supports Bluetooth 4.2 dual-mode (FW depen-
dent)
- BDR/EDR transport for audio, voice, and
SPP data exchange
- BLE transport for proprietary transparent
service and Apple Notification Center Service
(ANCS) data exchange
Operating Condition
• Operating voltage: 3.2V to 4.2V
• Operating temperature: -20°C to +70°C
Compliance
• Bluetooth SIG QDID: 83345 (BM62, BM64
Class 2) and 83336 (BM64 Class 1)
• Certified to the United States (FCC), Canada (IC),
European Economic Area (CE), Korea (KCC), Tai-
wan (NCC), Japan (MIC), and China (SRRC)
radio regulations
Applications
• Soundbar and Subwoofer (FW dependent)
• Bluetooth portable speaker phone
• Multi-speaker (FW dependent)
DS60001403B-Page 2
Preliminary
2016 Microchip Technology Inc.
BM62/64
Table of Contents
1.0 Device Overview ....................................................................................................................................................... 5
2.0 Audio ....................................................................................................................................................................... 15
3.0 Transceiver ............................................................................................................................................................. 19
4.0 Power Management Unit ........................................................................................................................................ 21
5.0 Application Information ........................................................................................................................................... 23
6.0 Printed Antenna Information ................................................................................................................................... 39
7.0 Physical Dimensions ............................................................................................................................................... 43
8.0 Electrical Characteristics......................................................................................................................................... 47
9.0 Soldering Recommendations .................................................................................................................................. 55
10.0 Ordering Information ............................................................................................................................................. 57
Appendix A: Certification Notices.................................................................................................................................. 59
Appendix B: Revision History........................................................................................................................................ 67
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at
docerrorsmicrochip.com
or fax the
Reader Response Form
in the back of this data sheet to (480) 792-4150. We wel-
come your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site;
http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.
Customer Notification System
Register on our web site at
www.microchip.com
to receive the most current information on all of our products.
2016 Microchip Technology Inc.
Preliminary
DS60001403B-Page 3
BM62/64
NOTES:
DS60001403B-Page 4
Preliminary
2016 Microchip Technology Inc.
BM62/64
1.0
DEVICE OVERVIEW
Windows-based utility.
Note:
The UI and DSP tools are available for
download from the Microchip web site at:
www.microchip.com/BM62
and
www.microchip.com/BM64.
The BM62 and BM64 Stereo Audio modules are built
around Microchip Technology IS2062 and IS2064
SoCs respectively.
The IS2062/64 SoC integrates the Bluetooth 4.2 dual-
mode radio transceiver, Power Management Unit
(PMU), a crystal and DSP. Users can configure the
BM62/64 module by using the UI tool and DSP tool, a
Figure 1-1
illustrates a typical example of the BM62
module which is connected to an external audio ampli-
fier and the MCU.
FIGURE 1-1:
APPLICATION USING BM62 MODULE
Figure 1-2
illustrates a typical example of the Class 1
BM64 module which is connected to an external MCU
and a DSP/codec.
FIGURE 1-2:
APPLICATION USING BM64 MODULE
2016 Microchip Technology Inc.
Preliminary
DS60001403B-Page 5
京公网安备 11010802033920号
EEWORLD
