ATF16LV8C datasheet, PDF - EEWORLD Datasheet

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ATF16LV8C: DescriptionHigh- Performance EE PLD; File Size152KB，10 Pages; ManufacturerAtmel (Microchip)

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ATF16LV8C Overview

High- Performance EE PLD

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Features

•

3.0V to 5.5V Operation

•

Industry Standard Architecture

•

– Emulates Many 20-Pin PALs

– Low Cost Easy-to-Use Software Tools

High Speed

– 10 ns Maximum Pin-to-Pin Delay

Ultra-Low Power

– 5

A (Max.) Pin-Controlled Power Down Mode Option

– Typical 100 nA Standby

CMOS and TTL Compatible Inputs and Outputs

– I/O Pin Keeper Circuits

Advanced Flash Technology

– Reprogrammable

– 100% Tested

High Reliability CMOS Process

– 20 Year Data Retention

– 100 Erase/Write Cycles

– 2,000V ESD Protection

– 200 mA Latchup Immunity

Commercial and Industrial Temperature Ranges

Dual-in-Line and Surface Mount Packages in Standard Pinouts

High-

Performance

EE PLD

ATF16LV8C

•

Description

The ATF16LV8C is a high-performance EECMOS Programmable Logic Device that

utilizes Atmel's proven electrically erasable Flash memory technology. Speeds down

to 10 ns and a 5

µA

pin-controlled power down mode option are offered. All speed

ranges are specified over the full 3.0V to 5.25V range for industrial and commercial

temperature ranges.

(continued)

Pin Configurations

Pin Name

CLK

I/O

VCC

Function

Clock

Logic Inputs

Bidirectional Buffers

Output Enable

(+3V to 5.5V) Supply

Programmable Power

Down Option

PLCC

I/CLK

PD/I3

GND

TSSOP

VCC

I/O

19/OE

DIP/SOIC

Rev. 0403E–06/98

Top View

ATF16LV8C Related Products

	ATF16LV8C	ATF16LV8C-10	ATF16LV8C-10SI	ATF16LV8C-15PC	ATF16LV8C-10JI	ATF16LV8C-15PI	ATF16LV8C-15XC	ATF16LV8C-15JC	ATF16LV8C-15XI
Description	High- Performance EE PLD	High- Performance EE PLD	High- Performance EE PLD	High- Performance EE PLD	High- Performance EE PLD	High- Performance EE PLD	High- Performance EE PLD	High- Performance EE PLD	High- Performance EE PLD
Is it lead-free?	-	-	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	-
Is it Rohs certified?	-	-	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	-	-	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)
Parts packaging code	-	-	SOIC	DIP	LPCC	DIP	TSSOP	LPCC	TSSOP
package instruction	-	-	SOP, SOP20,.4	DIP, DIP20,.3	QCCJ, LDCC20,.4SQ	DIP, DIP20,.3	4.40 MM, PLASTIC, MO-153, TSSOP-20	QCCJ, LDCC20,.4SQ	4.40 MM, PLASTIC, MO-153, TSSOP-20
Contacts	-	-	20	20	20	20	20	20	20
Reach Compliance Code	-	-	compli	unknow	compli	unknow	unknow	compli	unknow
ECCN code	-	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	-
Architecture	-	-	PAL-TYPE	PAL-TYPE	PAL-TYPE	PAL-TYPE	PAL-TYPE	PAL-TYPE	PAL-TYPE
maximum clock frequency	-	-	71.4 MHz	45 MHz	71 MHz	45 MHz	45.5 MHz	45 MHz	45.5 MHz
JESD-30 code	-	-	R-PDSO-G20	R-PDIP-T20	S-PQCC-J20	R-PDIP-T20	R-PDSO-G20	S-PQCC-J20	R-PDSO-G20
JESD-609 code	-	-	e0	e0	e0	e0	e0	e0	e0
length	-	-	12.8 mm	25.908 mm	8.966 mm	25.908 mm	6.5 mm	8.966 mm	6.5 mm
Humidity sensitivity level	-	-	2	1	2	1	2	2	2
Dedicated input times	-	-	7	7	7	7	7	7	7
Number of I/O lines	-	-	8	8	8	8	8	8	8
Number of entries	-	-	18	18	18	18	18	18	18
Output times	-	-	8	8	8	8	8	8	8
Number of product terms	-	-	64	64	64	64	64	64	64
Number of terminals	-	-	20	20	20	20	20	20	20
Maximum operating temperature	-	-	85 °C	70 °C	85 °C	85 °C	70 °C	70 °C	85 °C
organize	-	-	7 DEDICATED INPUTS, 8 I/O	7 DEDICATED INPUTS, 8 I/O	7 DEDICATED INPUTS, 8 I/O	7 DEDICATED INPUTS, 8 I/O	7 DEDICATED INPUTS, 8 I/O	7 DEDICATED INPUTS, 8 I/O	7 DEDICATED INPUTS, 8 I/O
Output function	-	-	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL
Package body material	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	-	SOP	DIP	QCCJ	DIP	TSSOP	QCCJ	TSSOP
Encapsulate equivalent code	-	-	SOP20,.4	DIP20,.3	LDCC20,.4SQ	DIP20,.3	TSSOP20,.25	LDCC20,.4SQ	TSSOP20,.25
Package shape	-	-	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	-	-	SMALL OUTLINE	IN-LINE	CHIP CARRIER	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	CHIP CARRIER	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	-	-	240	225	225	225	240	225	240
power supply	-	-	3.3/5 V	3.3/5 V	3.3/5 V	3.3/5 V	3.3/5 V	3.3/5 V	3.3/5 V
Programmable logic type	-	-	FLASH PLD	FLASH PLD	FLASH PLD	FLASH PLD	FLASH PLD	FLASH PLD	FLASH PLD
propagation delay	-	-	10 ns	15 ns	10 ns	15 ns	15 ns	15 ns	15 ns
Certification status	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	-	2.65 mm	5.334 mm	4.572 mm	5.334 mm	1.2 mm	4.572 mm	1.2 mm
Maximum supply voltage	-	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	-	-	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage	-	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	-	-	YES	NO	YES	NO	YES	YES	YES
technology	-	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	-	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	-	-	GULL WING	THROUGH-HOLE	J BEND	THROUGH-HOLE	GULL WING	J BEND	GULL WING
Terminal pitch	-	-	1.27 mm	2.54 mm	1.27 mm	2.54 mm	0.65 mm	1.27 mm	0.65 mm
Terminal location	-	-	DUAL	DUAL	QUAD	DUAL	DUAL	QUAD	DUAL
Maximum time at peak reflow temperature	-	-	30	30	30	30	30	30	30
width	-	-	7.5 mm	7.62 mm	8.966 mm	7.62 mm	4.4 mm	8.966 mm	4.4 mm

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