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ATF16LV8C-10JI

Description
High- Performance EE PLD
CategoryProgrammable logic devices    Programmable logic   
File Size152KB,10 Pages
ManufacturerAtmel (Microchip)
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ATF16LV8C-10JI Overview

High- Performance EE PLD

ATF16LV8C-10JI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAtmel (Microchip)
Parts packaging codeLPCC
package instructionQCCJ, LDCC20,.4SQ
Contacts20
Reach Compliance Codecompli
ECCN codeEAR99
Other features8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
ArchitecturePAL-TYPE
maximum clock frequency71 MHz
JESD-30 codeS-PQCC-J20
JESD-609 codee0
length8.966 mm
Humidity sensitivity level2
Dedicated input times7
Number of I/O lines8
Number of entries18
Output times8
Number of product terms64
Number of terminals20
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize7 DEDICATED INPUTS, 8 I/O
Output functionMACROCELL
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC20,.4SQ
Package shapeSQUARE
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)225
power supply3.3/5 V
Programmable logic typeFLASH PLD
propagation delay10 ns
Certification statusNot Qualified
Maximum seat height4.572 mm
Maximum supply voltage5.5 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width8.966 mm
Features
3.0V to 5.5V Operation
Industry Standard Architecture
– Emulates Many 20-Pin PALs
®
– Low Cost Easy-to-Use Software Tools
High Speed
– 10 ns Maximum Pin-to-Pin Delay
Ultra-Low Power
– 5
µ
A (Max.) Pin-Controlled Power Down Mode Option
– Typical 100 nA Standby
CMOS and TTL Compatible Inputs and Outputs
– I/O Pin Keeper Circuits
Advanced Flash Technology
– Reprogrammable
– 100% Tested
High Reliability CMOS Process
– 20 Year Data Retention
– 100 Erase/Write Cycles
– 2,000V ESD Protection
– 200 mA Latchup Immunity
Commercial and Industrial Temperature Ranges
Dual-in-Line and Surface Mount Packages in Standard Pinouts
High-
Performance
EE PLD
ATF16LV8C
Description
The ATF16LV8C is a high-performance EECMOS Programmable Logic Device that
utilizes Atmel's proven electrically erasable Flash memory technology. Speeds down
to 10 ns and a 5
µA
pin-controlled power down mode option are offered. All speed
ranges are specified over the full 3.0V to 5.25V range for industrial and commercial
temperature ranges.
(continued)
Pin Configurations
Pin Name
CLK
I
I/O
OE
VCC
PD
Function
Clock
Logic Inputs
Bidirectional Buffers
Output Enable
(+3V to 5.5V) Supply
Programmable Power
Down Option
PLCC
I/CLK
I1
I2
PD/I3
I4
I5
I6
I7
I8
GND
1
2
3
4
5
6
7
8
9
10
TSSOP
20
19
18
17
16
15
14
13
12
11
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
19/OE
DIP/SOIC
Rev. 0403E–06/98
Top View
1

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Description High- Performance EE PLD High- Performance EE PLD High- Performance EE PLD High- Performance EE PLD High- Performance EE PLD High- Performance EE PLD High- Performance EE PLD High- Performance EE PLD High- Performance EE PLD
Is it lead-free? Contains lead - Contains lead Contains lead - Contains lead Contains lead Contains lead -
Is it Rohs certified? incompatible - incompatible incompatible - incompatible incompatible incompatible incompatible
Maker Atmel (Microchip) - Atmel (Microchip) Atmel (Microchip) - Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip)
Parts packaging code LPCC - SOIC DIP - DIP TSSOP LPCC TSSOP
package instruction QCCJ, LDCC20,.4SQ - SOP, SOP20,.4 DIP, DIP20,.3 - DIP, DIP20,.3 4.40 MM, PLASTIC, MO-153, TSSOP-20 QCCJ, LDCC20,.4SQ 4.40 MM, PLASTIC, MO-153, TSSOP-20
Contacts 20 - 20 20 - 20 20 20 20
Reach Compliance Code compli - compli unknow - unknow unknow compli unknow
ECCN code EAR99 - EAR99 EAR99 - EAR99 EAR99 EAR99 -
Architecture PAL-TYPE - PAL-TYPE PAL-TYPE - PAL-TYPE PAL-TYPE PAL-TYPE PAL-TYPE
maximum clock frequency 71 MHz - 71.4 MHz 45 MHz - 45 MHz 45.5 MHz 45 MHz 45.5 MHz
JESD-30 code S-PQCC-J20 - R-PDSO-G20 R-PDIP-T20 - R-PDIP-T20 R-PDSO-G20 S-PQCC-J20 R-PDSO-G20
JESD-609 code e0 - e0 e0 - e0 e0 e0 e0
length 8.966 mm - 12.8 mm 25.908 mm - 25.908 mm 6.5 mm 8.966 mm 6.5 mm
Humidity sensitivity level 2 - 2 1 - 1 2 2 2
Dedicated input times 7 - 7 7 - 7 7 7 7
Number of I/O lines 8 - 8 8 - 8 8 8 8
Number of entries 18 - 18 18 - 18 18 18 18
Output times 8 - 8 8 - 8 8 8 8
Number of product terms 64 - 64 64 - 64 64 64 64
Number of terminals 20 - 20 20 - 20 20 20 20
Maximum operating temperature 85 °C - 85 °C 70 °C - 85 °C 70 °C 70 °C 85 °C
organize 7 DEDICATED INPUTS, 8 I/O - 7 DEDICATED INPUTS, 8 I/O 7 DEDICATED INPUTS, 8 I/O - 7 DEDICATED INPUTS, 8 I/O 7 DEDICATED INPUTS, 8 I/O 7 DEDICATED INPUTS, 8 I/O 7 DEDICATED INPUTS, 8 I/O
Output function MACROCELL - MACROCELL MACROCELL - MACROCELL MACROCELL MACROCELL MACROCELL
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ - SOP DIP - DIP TSSOP QCCJ TSSOP
Encapsulate equivalent code LDCC20,.4SQ - SOP20,.4 DIP20,.3 - DIP20,.3 TSSOP20,.25 LDCC20,.4SQ TSSOP20,.25
Package shape SQUARE - RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
Package form CHIP CARRIER - SMALL OUTLINE IN-LINE - IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 225 - 240 225 - 225 240 225 240
power supply 3.3/5 V - 3.3/5 V 3.3/5 V - 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V
Programmable logic type FLASH PLD - FLASH PLD FLASH PLD - FLASH PLD FLASH PLD FLASH PLD FLASH PLD
propagation delay 10 ns - 10 ns 15 ns - 15 ns 15 ns 15 ns 15 ns
Certification status Not Qualified - Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.572 mm - 2.65 mm 5.334 mm - 5.334 mm 1.2 mm 4.572 mm 1.2 mm
Maximum supply voltage 5.5 V - 5.5 V 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 3 V - 3 V 3 V - 3 V 3 V 3 V 3 V
Nominal supply voltage 3.3 V - 3.3 V 3.3 V - 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES - YES NO - NO YES YES YES
technology CMOS - CMOS CMOS - CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL - INDUSTRIAL COMMERCIAL - INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND - GULL WING THROUGH-HOLE - THROUGH-HOLE GULL WING J BEND GULL WING
Terminal pitch 1.27 mm - 1.27 mm 2.54 mm - 2.54 mm 0.65 mm 1.27 mm 0.65 mm
Terminal location QUAD - DUAL DUAL - DUAL DUAL QUAD DUAL
Maximum time at peak reflow temperature 30 - 30 30 - 30 30 30 30
width 8.966 mm - 7.5 mm 7.62 mm - 7.62 mm 4.4 mm 8.966 mm 4.4 mm
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