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HM5-6564-5

Description
HM5-6564-5
Categorystorage    storage   
File Size442KB,6 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

HM5-6564-5 Overview

HM5-6564-5

HM5-6564-5 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
Reach Compliance Code_compli
Maximum access time500 ns
I/O typeSEPARATE
JESD-30 codeR-XDIP-T40
JESD-609 codee0
memory density65536 bi
Memory IC TypeSRAM MODULE
memory width8
Number of terminals40
word count8192 words
character code8000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8KX8
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP40,.9
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum standby current0.0036 A
Minimum standby current2 V
Maximum slew rate0.06 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

HM5-6564-5 Related Products

HM5-6564-5 5962-01-178-2798 HM5-6564-2 HM5-6564-9
Description HM5-6564-5 MEMORY MODULE,SYNC SRAM,8KX8,CMOS,DIP,40PIN,CERAMIC HM5-6564-2 HM5-6564-9
Is it Rohs certified? incompatible incompatible incompatible incompatible
Reach Compliance Code _compli _compli _compli _compli
Maximum access time 500 ns 400 ns 400 ns 400 ns
I/O type SEPARATE SEPARATE SEPARATE SEPARATE
JESD-30 code R-XDIP-T40 R-XDIP-T40 R-XDIP-T40 R-XDIP-T40
memory density 65536 bi 65536 bi 65536 bi 65536 bi
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
memory width 8 8 8 8
Number of terminals 40 40 40 40
word count 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 125 °C 125 °C 85 °C
Minimum operating temperature - -55 °C -55 °C -40 °C
organize 8KX8 8KX8 8KX8 8KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP DIP DIP
Encapsulate equivalent code DIP40,.9 DIP40,.9 DIP40,.9 DIP40,.9
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.0036 A 0.0004 A 0.0004 A 0.0004 A
Minimum standby current 2 V 2 V 2 V 2 V
Maximum slew rate 0.06 mA 0.056 mA 0.056 mA 0.056 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO NO NO NO
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL MILITARY MILITARY INDUSTRIAL
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
Maker Renesas Electronics Corporation - Renesas Electronics Corporation Renesas Electronics Corporation
JESD-609 code e0 - e0 e0
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
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