S70FL512SAGMFIR11 datasheet, PDF

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S70FL512SAGMFIR11: DescriptionFlash, 512MX1, PDSO16, 300 MIL, LEAD FREE, MS-013AA, SOIC-16; Categorystorage storage; File Size751KB，19 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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S70FL512SAGMFIR11 Overview

Flash, 512MX1, PDSO16, 300 MIL, LEAD FREE, MS-013AA, SOIC-16

S70FL512SAGMFIR11 Parametric

Parameter Name	Attribute value
Maker	SPANSION
Parts packaging code	SOIC
package instruction	SOP,
Contacts	16
Reach Compliance Code	unknow
ECCN code	3A991.B.1.A
Maximum clock frequency (fCLK)	133 MHz
JESD-30 code	R-PDSO-G16
length	10.3 mm
memory density	536870912 bi
Memory IC Type	FLASH
memory width	1
Number of functions	1
Number of terminals	16
word count	536870912 words
character code	512000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512MX1
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
Programming voltage	3 V
Maximum seat height	2.65 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
width	7.5 mm

S70FL512SAGMFIR11 Preview

S70FL512S

512 Mbit (64 Mbyte)

MirrorBit

Flash Non-Volatile Memory

CMOS 3.0-Volt Core Serial Peripheral Interface with Multi-I/O

Data Sheet

(Advance Information)

S70FL512S Cover Sheet

Notice to Readers:

This document states the current technical specifications regarding the Spansion

product(s) described herein. Each product described herein may be designated as Advance Information,

Preliminary, or Full Production. See

Notice On Data Sheet Designations

for definitions.

Publication Number

S70FL512S_00

Revision

Issue Date

September 8, 2011

D a t a

S h e e t

( A d va n c e

I n fo r m a t i o n )

Notice On Data Sheet Designations

Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of

product information or intended specifications throughout the product life cycle, including development,

qualification, initial production, and full production. In all cases, however, readers are encouraged to verify

that they have the latest information before finalizing their design. The following descriptions of Spansion data

sheet designations are presented here to highlight their presence and definitions.

Advance Information

The Advance Information designation indicates that Spansion Inc. is developing one or more specific

products, but has not committed any design to production. Information presented in a document with this

designation is likely to change, and in some cases, development on the product may discontinue. Spansion

Inc. therefore places the following conditions upon Advance Information content:

“This document contains information on one or more products under development at Spansion Inc.

The information is intended to help you evaluate this product. Do not design in this product without

contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed

product without notice.”

Preliminary

The Preliminary designation indicates that the product development has progressed such that a commitment

to production has taken place. This designation covers several aspects of the product life cycle, including

product qualification, initial production, and the subsequent phases in the manufacturing process that occur

before full production is achieved. Changes to the technical specifications presented in a Preliminary

document should be expected while keeping these aspects of production under consideration. Spansion

places the following conditions upon Preliminary content:

“This document states the current technical specifications regarding the Spansion product(s)

described herein. The Preliminary status of this document indicates that product qualification has been

completed, and that initial production has begun. Due to the phases of the manufacturing process that

require maintaining efficiency and quality, this document may be revised by subsequent versions or

modifications due to changes in technical specifications.”

Combination

Some data sheets contain a combination of products with different designations (Advance Information,

Preliminary, or Full Production). This type of document distinguishes these products and their designations

wherever necessary, typically on the first page, the ordering information page, and pages with the DC

Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first

page refers the reader to the notice on this page.

Full Production (No Designation on Document)

When a product has been in production for a period of time such that no changes or only nominal changes

are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include

those affecting the number of ordering part numbers available, such as the addition or deletion of a speed

option, temperature range, package type, or V

range. Changes may also include those needed to clarify a

description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following

conditions to documents in this category:

“This document states the current technical specifications regarding the Spansion product(s)

described herein. Spansion Inc. deems the products to have been in sufficient production volume such

that subsequent versions of this document are not expected to change. However, typographical or

specification corrections, or modifications to the valid combinations offered may occur.”

Questions regarding these document designations may be directed to your local sales office.

S70FL512S

S70FL512S_00_01 September 8, 2011

S70FL512S

512 Mbit (64 Mbyte)

MirrorBit

Flash Non-Volatile Memory

CMOS 3.0-Volt Core Serial Peripheral Interface with Multi-I/O

Data Sheet

(Advance Information)

Features



Density

– 512 Mbits (64 Mbytes)



Security features

– One Time Program (OTP) array of 1024 bytes

– Block Protection:

– Status Register bits to control protection against program or

erase of a contiguous range of sectors.

– Hardware and software control options

– Advanced Sector Protection (ASP)

– Individual sector protection controlled by boot code or password



Serial Peripheral Interface (SPI)

– SPI Clock polarity and phase modes 0 and 3

– Extended Addressing: 24- or 32-bit address options

– Serial Command set and footprint compatible with S25FL-A,

S25FL-K, and S25FL-P SPI families

– Multi I/O Command set and footprint compatible with

S25FL-P SPI family



READ Commands

– Normal, Fast, Dual, and Quad

– AutoBoot - power up or reset and execute a Normal or Quad read

command automatically at a preselected address

– Common Flash Interface (CFI) data for configuration information.



Spansion

65 nm MirrorBit Technology with Eclipse

™

Architecture



Core Supply Voltage: 2.7V to 3.6V



Temperature Range:

– Industrial (-40

C to +85



Programming (1.5 Mbytes/s)

– 256 or 512 Bytes Page Programming buffer options

– Quad-Input Page Programming (QPP) for slow clock systems



Packages (all Pb-free)

– 16-lead SOIC (300 mil)

– BGA-24 6 x 8 mm

– 5 x 5 ball (FAB024) configuration



Erase (0.5 to 0.65 Mbytes/s)

– Uniform sector configuration - always erase 256-kbytes blocks for

software compatibility with higher density and future devices.

– 100,000 Program-Erase Cycles on any sector typical

– 20 Year Data Retention typical

General Description

This document contains information for the S70FL512S device, which is a dual die stack of two S25FL256S die. For detailed

specifications, please refer to the discrete die data sheet:

Document

S25FL128S and S25FL256S Data Sheet

Publication Identification Number (PID)

S25FL128S_256S_00

Publication Number

S70FL512S_00

Revision

Issue Date

September 8, 2011

This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in

this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.

D a t a

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Table of Contents

General Description

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Block Diagram

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

1.1

Block Diagram with RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

1.2

Block Diagram without RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Connection Diagrams

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Input/Output Descriptions

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Logic Symbol

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Device Operations

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.1

Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.2

Simultaneous Die Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.3

Sequential Reads. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.4

Sector/Bulk Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.5

Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.6

Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.7

Block Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.8

RESET# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Read Identification (RDID)

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Electrical Specifications

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

7.1

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Timing Specifications

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

8.1

Capacitance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Physical Dimensions

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

9.1

SS3 016 — 16-pin Wide Plastic Small Outline Package (300-mil Body Width) . . . . . . . . . . . 15

9.2

ZSA024 — 24-ball Ball Grid Array (8 x 6 mm) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Ordering Information

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

10.1 Valid Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Revision History

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

10.

11.

S70FL512S

S70FL512S_00_01 September 8, 2011

D a t a

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I n fo r m a t i o n )

Figures

Figure 2.1

Figure 2.2

16-Lead SOIC Package, Top View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

24-Ball BGA, 5 x 5 Ball Footprint (FAB024), Top View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

September 8, 2011 S70FL512S_00_01

S70FL512S

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S70FL512SAGMFIR11 Related Products

	S70FL512SAGMFIR11	S70FL512SAGMFI010	S70FL512SAGMFI011	S70FL512SAGMFI013	S70FL512SAGMFIR10	S70FL512SAGMFIR13
Description	Flash, 512MX1, PDSO16, 300 MIL, LEAD FREE, MS-013AA, SOIC-16	Flash, 512MX1, PDSO16, 300 MIL, LEAD FREE, MS-013AA, SOIC-16	Flash, 512MX1, PDSO16, 300 MIL, LEAD FREE, MS-013AA, SOIC-16	Flash, 512MX1, PDSO16, 300 MIL, LEAD FREE, MS-013AA, SOIC-16	Flash, 512MX1, PDSO16, 300 MIL, LEAD FREE, MS-013AA, SOIC-16	Flash, 512MX1, PDSO16, 300 MIL, LEAD FREE, MS-013AA, SOIC-16
Maker	SPANSION	SPANSION	SPANSION	SPANSION	SPANSION	SPANSION
Parts packaging code	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC
package instruction	SOP,	SOP,	SOP,	SOP,	SOP,	SOP,
Contacts	16	16	16	16	16	16
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknow
ECCN code	3A991.B.1.A	EAR99	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
Maximum clock frequency (fCLK)	133 MHz	133 MHz	133 MHz	133 MHz	133 MHz	133 MHz
JESD-30 code	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16
length	10.3 mm	10.3 mm	10.3 mm	10.3 mm	10.3 mm	10.3 mm
memory density	536870912 bi	536870912 bi	536870912 bi	536870912 bi	536870912 bi	536870912 bi
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	1	1	1	1	1	1
Number of functions	1	1	1	1	1	1
Number of terminals	16	16	16	16	16	16
word count	536870912 words	536870912 words	536870912 words	536870912 words	536870912 words	536870912 words
character code	512000000	512000000	512000000	512000000	512000000	512000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	512MX1	512MX1	512MX1	512MX1	512MX1	512MX1
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	SOP	SOP	SOP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Programming voltage	3 V	3 V	3 V	3 V	3 V	3 V
Maximum seat height	2.65 mm	2.65 mm	2.65 mm	2.65 mm	2.65 mm	2.65 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	7.5 mm	7.5 mm	7.5 mm	7.5 mm	7.5 mm	7.5 mm

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