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S70FL512SAGMFI011

Description
Flash, 512MX1, PDSO16, 300 MIL, LEAD FREE, MS-013AA, SOIC-16
Categorystorage    storage   
File Size751KB,19 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
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S70FL512SAGMFI011 Overview

Flash, 512MX1, PDSO16, 300 MIL, LEAD FREE, MS-013AA, SOIC-16

S70FL512SAGMFI011 Parametric

Parameter NameAttribute value
MakerSPANSION
Parts packaging codeSOIC
package instructionSOP,
Contacts16
Reach Compliance Codeunknow
ECCN code3A991.B.1.A
Maximum clock frequency (fCLK)133 MHz
JESD-30 codeR-PDSO-G16
length10.3 mm
memory density536870912 bi
Memory IC TypeFLASH
memory width1
Number of functions1
Number of terminals16
word count536870912 words
character code512000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512MX1
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialSERIAL
Programming voltage3 V
Maximum seat height2.65 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
width7.5 mm

S70FL512SAGMFI011 Preview

S70FL512S
512 Mbit (64 Mbyte)
MirrorBit
®
Flash Non-Volatile Memory
CMOS 3.0-Volt Core Serial Peripheral Interface with Multi-I/O
Data Sheet
(Advance Information)
S70FL512S Cover Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S70FL512S_00
Revision
01
Issue Date
September 8, 2011
D a t a
S h e e t
( A d va n c e
I n fo r m a t i o n )
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or V
IO
range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
2
S70FL512S
S70FL512S_00_01 September 8, 2011
S70FL512S
512 Mbit (64 Mbyte)
MirrorBit
®
Flash Non-Volatile Memory
CMOS 3.0-Volt Core Serial Peripheral Interface with Multi-I/O
Data Sheet
(Advance Information)
Features
Density
– 512 Mbits (64 Mbytes)
Security features
– One Time Program (OTP) array of 1024 bytes
– Block Protection:
– Status Register bits to control protection against program or
erase of a contiguous range of sectors.
– Hardware and software control options
– Advanced Sector Protection (ASP)
– Individual sector protection controlled by boot code or password
Serial Peripheral Interface (SPI)
– SPI Clock polarity and phase modes 0 and 3
– Extended Addressing: 24- or 32-bit address options
– Serial Command set and footprint compatible with S25FL-A,
S25FL-K, and S25FL-P SPI families
– Multi I/O Command set and footprint compatible with
S25FL-P SPI family
READ Commands
– Normal, Fast, Dual, and Quad
– AutoBoot - power up or reset and execute a Normal or Quad read
command automatically at a preselected address
– Common Flash Interface (CFI) data for configuration information.
Spansion
®
65 nm MirrorBit Technology with Eclipse
Architecture
Core Supply Voltage: 2.7V to 3.6V
Temperature Range:
– Industrial (-40
°
C to +85
°
C)
Programming (1.5 Mbytes/s)
– 256 or 512 Bytes Page Programming buffer options
– Quad-Input Page Programming (QPP) for slow clock systems
Packages (all Pb-free)
– 16-lead SOIC (300 mil)
– BGA-24 6 x 8 mm
– 5 x 5 ball (FAB024) configuration
Erase (0.5 to 0.65 Mbytes/s)
– Uniform sector configuration - always erase 256-kbytes blocks for
software compatibility with higher density and future devices.
– 100,000 Program-Erase Cycles on any sector typical
– 20 Year Data Retention typical
General Description
This document contains information for the S70FL512S device, which is a dual die stack of two S25FL256S die. For detailed
specifications, please refer to the discrete die data sheet:
Document
S25FL128S and S25FL256S Data Sheet
Publication Identification Number (PID)
S25FL128S_256S_00
Publication Number
S70FL512S_00
Revision
01
Issue Date
September 8, 2011
This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in
this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.
D a t a
S h e e t
( A d va n c e
I n fo r m a t i o n )
Table of Contents
General Description
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.
Block Diagram
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.1
Block Diagram with RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.2
Block Diagram without RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Connection Diagrams
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Input/Output Descriptions
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Logic Symbol
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Device Operations
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.1
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2
Simultaneous Die Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.3
Sequential Reads. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.4
Sector/Bulk Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.5
Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.6
Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.7
Block Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.8
RESET# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
11
11
11
11
11
11
11
11
2.
3.
4.
5.
6.
7.
8.
9.
Read Identification (RDID)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Electrical Specifications
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7.1
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Timing Specifications
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
8.1
Capacitance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Physical Dimensions
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
9.1
SS3 016 — 16-pin Wide Plastic Small Outline Package (300-mil Body Width) . . . . . . . . . . . 15
9.2
ZSA024 — 24-ball Ball Grid Array (8 x 6 mm) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Ordering Information
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
10.1 Valid Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision History
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
10.
11.
4
S70FL512S
S70FL512S_00_01 September 8, 2011
D a t a
S h e e t
( A d va n c e
I n fo r m a t i o n )
Figures
Figure 2.1
Figure 2.2
16-Lead SOIC Package, Top View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
24-Ball BGA, 5 x 5 Ball Footprint (FAB024), Top View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
September 8, 2011 S70FL512S_00_01
S70FL512S
5

S70FL512SAGMFI011 Related Products

S70FL512SAGMFI011 S70FL512SAGMFI010 S70FL512SAGMFI013 S70FL512SAGMFIR10 S70FL512SAGMFIR11 S70FL512SAGMFIR13
Description Flash, 512MX1, PDSO16, 300 MIL, LEAD FREE, MS-013AA, SOIC-16 Flash, 512MX1, PDSO16, 300 MIL, LEAD FREE, MS-013AA, SOIC-16 Flash, 512MX1, PDSO16, 300 MIL, LEAD FREE, MS-013AA, SOIC-16 Flash, 512MX1, PDSO16, 300 MIL, LEAD FREE, MS-013AA, SOIC-16 Flash, 512MX1, PDSO16, 300 MIL, LEAD FREE, MS-013AA, SOIC-16 Flash, 512MX1, PDSO16, 300 MIL, LEAD FREE, MS-013AA, SOIC-16
Maker SPANSION SPANSION SPANSION SPANSION SPANSION SPANSION
Parts packaging code SOIC SOIC SOIC SOIC SOIC SOIC
package instruction SOP, SOP, SOP, SOP, SOP, SOP,
Contacts 16 16 16 16 16 16
Reach Compliance Code unknow unknow unknow unknow unknow unknow
ECCN code 3A991.B.1.A EAR99 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
Maximum clock frequency (fCLK) 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz
JESD-30 code R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16
length 10.3 mm 10.3 mm 10.3 mm 10.3 mm 10.3 mm 10.3 mm
memory density 536870912 bi 536870912 bi 536870912 bi 536870912 bi 536870912 bi 536870912 bi
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH
memory width 1 1 1 1 1 1
Number of functions 1 1 1 1 1 1
Number of terminals 16 16 16 16 16 16
word count 536870912 words 536870912 words 536870912 words 536870912 words 536870912 words 536870912 words
character code 512000000 512000000 512000000 512000000 512000000 512000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 512MX1 512MX1 512MX1 512MX1 512MX1 512MX1
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP SOP SOP SOP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Programming voltage 3 V 3 V 3 V 3 V 3 V 3 V
Maximum seat height 2.65 mm 2.65 mm 2.65 mm 2.65 mm 2.65 mm 2.65 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
width 7.5 mm 7.5 mm 7.5 mm 7.5 mm 7.5 mm 7.5 mm

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