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PTN0805E1823DGTS

Description
RESISTOR, THIN FILM, 0.2 W, 0.5 %, 25 ppm, 182000 ohm, SURFACE MOUNT, 0805, CHIP, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size80KB,4 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance  
Download Datasheet Parametric View All

PTN0805E1823DGTS Overview

RESISTOR, THIN FILM, 0.2 W, 0.5 %, 25 ppm, 182000 ohm, SURFACE MOUNT, 0805, CHIP, ROHS COMPLIANT

PTN0805E1823DGTS Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerVishay
package instructionSMT, 0805
Reach Compliance Codecompli
ECCN codeEAR99
Other featuresANTI-SULFUR; LASER TRIMMABLE; NON-INDUCTIVE
structureRectangul
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.838 mm
Package length2.032 mm
Package formSMT
Package width1.27 mm
method of packingTR
Rated power dissipation(P)0.2 W
Rated temperature70 °C
resistance182000 Ω
Resistor typeFIXED RESISTOR
size code0805
surface mountYES
technologyTHIN FILM
Temperature Coefficient25 ppm/°C
Terminal surfaceGold (Au) - with Nickel (Ni) barrie
Terminal shapeWRAPAROUND
Tolerance0.5%
Operating Voltage100 V
PTN
Vishay Thin Film
Commercial Thin Film Chip Resistor, Surface Mount Chip
FEATURES
• Moisture resistant
• High purity alumina substrate
• Non-standard values available
Actual Size
1505
• Will pass + 85 °C, 85 % relative humidity and
10 % rated power
• 100 % visual inspected per MIL-PRF-55342
• Very low noise and voltage coefficient (< - 30 dB)
• Non-inductive
• Laser-trimmed tolerances to ± 0.1 %
• Wraparound resistance less than 10 mΩ
• Epoxy bondable termination available
• Compliant to RoHS Directive 2002/95/EC
These chip resistors are available in both “top side” and
“wraparound” termination styles in a variety of sizes. They
incorporate self passivated, enhanced Tantalum Nitride
films, to give superior performance on moisture resistance,
voltage coefficient, power handling and resistance stability.
The terminations consist of an adhesion layer, a leach
resistant nickel barrier, and solder coating. This product will
out-perform all requirements of characteristic E of
MIL-PRF-55342.
CONSTRUCTION
Passivation
Tantalum Nitride
Resistive Film
Solder
Coating
TYPICAL PERFORMANCE
ABSOLUTE
TCR
25
0.1
Nickel Barrier
High Purity
Alumina Substrate
Adhesion Layer
TOL.
STANDARD ELECTRICAL SPECIFICATIONS
TEST
Material
Resistance Range
TCR: Absolute
Tolerance: Absolute
Stability: Absolute
Stability: Ratio
Voltage Coefficient
Working Voltage
Operating Temperature Range
Storage Temperature Range
Noise
Shelf Life Stability: Absolute
SPECIFICATIONS
Tantalum nitride
10
Ω
to 3 MΩ
± 25 ppm/°C to ± 100 ppm/°C
± 0.1 % to ± 5 %
ΔR
± 0.03 %
-
0.1 ppm/V
75 V to 200 V
- 55 °C to + 125 °C
- 55 °C to + 150 °C
< - 30 dB
-
CONDITIONS
-
-
- 55 °C to + 125 °C
+ 25 °C
2000 h at 70 °C
-
-
-
-
-
-
-
COMPONENT RATINGS
CASE SIZE
(1)
POWER RATING (mW)
0402
50
0502
100
0505
150
0603
150
0705
200
0805
200
1005
250
1010
500
1206
400
1505
400
2208
750
2010
800
2512
1000
Note
(1)
0705 and 0805 are the same (only use 0805 when ordering)
WORKING VOLTAGE (V)
75
75
75
75
100
100
100
150
200
150
150
200
200
RESISTANCE RANGE (Ω)
20 to 35K
20 to 65K
20 to 130K
10 to 120K
10 to 301K
10 to 301K
10 to 360K
50 to 600K
10 to 1M
10 to 1M
10 to 1.75M
10 to 2M
10 to 3M
* Pb containing terminations are not RoHS compliant, exemptions may apply
www.vishay.com
64
For technical questions, contact:
thinfilm@vishay.com
Document Number: 60026
Revision: 30-Nov-10
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