LD062A181KAB9A datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> capacitor> LD062A181KAB9A

LD062A181KAB9A: DescriptionCeramic Capacitor, Multilayer, Ceramic, 200V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 1206, CHIP; CategoryPassive components capacitor; File Size99KB，7 Pages; ManufacturerAVX

Download Datasheet Parametric View All

LD062A181KAB9A Overview

Ceramic Capacitor, Multilayer, Ceramic, 200V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 1206, CHIP

LD062A181KAB9A Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	AVX
package instruction	, 1206
Reach Compliance Code	_compli
ECCN code	EAR99
capacitance	0.00018 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	0.94 mm
JESD-609 code	e0
length	3.2 mm
Manufacturer's serial number	LD06
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	10%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	BULK
positive tolerance	10%
Rated (DC) voltage (URdc)	200 V
series	LD
size code	1206
surface mount	YES
Temperature characteristic code	C0G
Temperature Coefficient	-/+30ppm/Cel ppm/°C
Terminal surface	Tin/Lead (Sn/Pb)
Terminal shape	WRAPAROUND
width	1.6 mm

Preview

Download Datasheet

View All

MLCC Tin/Lead Termination “B”

General Specifications

AVX Corporation will support those customers for

commercial and military Multilayer Ceramic Capacitors with

a termination consisting of 5% minimum lead. This

termination is indicated by the use of a “B” in the 12th

position of the AVX Catalog Part Number. This fulfills AVX’s

commitment to providing a full range of products to our

customers. AVX has provided in the following pages a full

range of values that we are currently offering in this special

“B” termination. Please contact the factory if you require

additional information on our MLCC Tin/Lead Termination

“B” products.

PART NUMBER (see page 2 for complete part number explanation)

LD05

Size

LD02 - 0402

LD03 - 0603

LD04 - 0504*

LD05 - 0805

LD06 - 1206

LD10 - 1210

LD12 - 1812

LD13 - 1825

LD14 - 2225

LD20 - 2220

101

Capacitance

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Capacitance

Tolerance

Packaging

2 = 7" Reel

4 = 13" Reel

7 = Bulk Cass.

9 = Bulk

Special

Code

A = Std.

Product

Dielectric

Voltage

6.3V = 6 C0G (NP0) = A

X7R = C

10V = Z

X5R = D

16V = Y

X8R = F

25V = 3

35V = D

50V = 5

100V = 1

200V = 2

500V = 7

±.10 pF (<10pF)

±.25 pF (<10pF)

±.50 pF (<10pF)

±1% (≥ 10 pF)

±2% (≥ 10 pF)

±5%

±10%

±20%

Terminations

Failure

Rate

B = 5% min lead

A = Not X = FLEXITERM

Applicable

with 5% min

lead**

**X7R only

Contact

Factory

For

Multiples

*LD04 has the same CV ranges as LD03.

NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.

Contact factory for non-specified capacitance values.

See FLEXITERM

section

for CV options

NP0

X7R

X7S

X5R

Y5V

Refer to page 4 for Electrical Graphs

Refer to page 16 for Electrical Graphs

Refer to page 20 for Electrical Graphs

Refer to page 23 for Electrical Graphs

Refer to page 26 for Electrical Graphs

Recommended Resources

Novel solar LED light controller circuit diagram

Single phase thyristor slotless nickel plated power circuit

Adjustable crossover point balanced subwoofer circuit

Practical AM-4 module circuit schematic designed using TGS4160 sensor

RTD sensor and 24-bit AD7711A circuit

Game circuit to judge reaction time

Please help me, what is wrong with the program of the electronic scale, thank you!!!: #include"60S2_V3.h"char bdata bittest ; sbit TIbit = bittest ^ 0 ; unsigned long i , sum = 0 , result = 0 , temp , ASC[] , count ; u8 T_COUNT , adc_hi , adc_low , a , sign ;void main(void) { //ADADC_C...; slichee Microchip MCU

About NDIS display data packet content: If I want to intercept network data packets at the NDIS intermediate driver layer, then if I want to output all NDIS packets intercepted at the NDIS intermediate driver layer, including the header and...; hufangger Embedded System

Implementation and details of displaying multiple widgets in centralWidget: [size=4]1. Display multiple widgets in the object in QMainWindow. [/size] [size=4]1. Display multiple widgets in the object in QMainWindow. [/size] [size=4] Everyone knows that the method of setCentra...; Jacktang Microcontroller MCU

OP27 circuit diagram: Can anyone who makes circuits help me look at what function this circuit achieves? I don’t understand the input and output. . . ....; 小可姐 Analog electronics

What would you do if you encountered this situation?: I received two offers, one for embedded electronic dictionary development and the other for Linux billing development. I don't know which one to go for now? My previous job was developing Linux, but I...; fanghaoshfs Embedded System

IMP813L: Has anyone used the IMP813L watchdog chip? Please help me. I want a solution. The WDI watchdog signal is placed in the software delay function (WDI = ~WDI), and the time is definitely less than 1.6 se...; zhangyuebin 51mcu

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components