Low-Power, Wideband, Closed-Loop Buffer
| Parameter Name | Attribute value |
| Maker | National Semiconductor(TI ) |
| Parts packaging code | WAFER |
| package instruction | DIE, |
| Contacts | 4 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Amplifier type | BUFFER |
| Maximum average bias current (IIB) | 4 µA |
| Nominal bandwidth (3dB) | 270 MHz |
| Maximum input offset voltage | 5000 µV |
| JESD-30 code | X-XUUC-N4 |
| Negative supply voltage upper limit | -7 V |
| Nominal Negative Supply Voltage (Vsup) | -5 V |
| Number of functions | 1 |
| Number of terminals | 4 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Minimum output current | 0.04 A |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | UNSPECIFIED |
| Package form | UNCASED CHIP |
| Certification status | Not Qualified |
| minimum slew rate | 250 V/us |
| Nominal slew rate | 350 V/us |
| Maximum slew rate | 4 mA |
| Supply voltage upper limit | 7 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Base Number Matches | 1 |
| CLC109ALC | CLC109 | CLC109AJE | CLC109AJM5 | CLC109AJP | CLC109AMC | |
|---|---|---|---|---|---|---|
| Description | Low-Power, Wideband, Closed-Loop Buffer | Low-Power, Wideband, Closed-Loop Buffer | Low-Power, Wideband, Closed-Loop Buffer | Low-Power, Wideband, Closed-Loop Buffer | Low-Power, Wideband, Closed-Loop Buffer | Low-Power, Wideband, Closed-Loop Buffer |
| Parts packaging code | WAFER | - | SOIC | SOT-23 | DIP | WAFER |
| package instruction | DIE, | - | SOP, SOP8,.25 | LSSOP, TSOP5/6,.11,37 | DIP, DIP8,.3 | DIE, |
| Contacts | 4 | - | 8 | 5 | 8 | - |
| Reach Compliance Code | unknow | - | unknow | unknow | unknow | unknow |
| ECCN code | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| Amplifier type | BUFFER | - | BUFFER | BUFFER | BUFFER | BUFFER |
| Maximum average bias current (IIB) | 4 µA | - | 4 µA | 8 µA | 4 µA | 4 µA |
| Nominal bandwidth (3dB) | 270 MHz | - | 270 MHz | 270 MHz | 270 MHz | 270 MHz |
| Maximum input offset voltage | 5000 µV | - | 5000 µV | 8200 µV | 5000 µV | 5000 µV |
| JESD-30 code | X-XUUC-N4 | - | R-PDSO-G8 | R-PDSO-G5 | R-PDIP-T8 | X-XUUC-N4 |
| Negative supply voltage upper limit | -7 V | - | -7 V | -7 V | -7 V | -7 V |
| Nominal Negative Supply Voltage (Vsup) | -5 V | - | -5 V | -5 V | -5 V | -5 V |
| Number of functions | 1 | - | 1 | 1 | 1 | 1 |
| Number of terminals | 4 | - | 8 | 5 | 8 | 4 |
| Maximum operating temperature | 125 °C | - | 85 °C | 85 °C | 85 °C | 125 °C |
| Minimum operating temperature | -55 °C | - | -40 °C | -40 °C | -40 °C | -55 °C |
| Minimum output current | 0.04 A | - | 0.04 A | 0.04 A | 0.04 A | 0.04 A |
| Package body material | UNSPECIFIED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| encapsulated code | DIE | - | SOP | LSSOP | DIP | DIE |
| Package shape | UNSPECIFIED | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED |
| Package form | UNCASED CHIP | - | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | IN-LINE | UNCASED CHIP |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| minimum slew rate | 250 V/us | - | 250 V/us | 220 V/us | 250 V/us | 250 V/us |
| Nominal slew rate | 350 V/us | - | 350 V/us | 350 V/us | 350 V/us | 350 V/us |
| Maximum slew rate | 4 mA | - | 4 mA | 4 mA | 4 mA | 4 mA |
| Supply voltage upper limit | 7 V | - | 7 V | 7 V | 7 V | 7 V |
| Nominal supply voltage (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | - | YES | YES | NO | YES |
| technology | BIPOLAR | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY |
| Terminal form | NO LEAD | - | GULL WING | GULL WING | THROUGH-HOLE | NO LEAD |
| Terminal location | UPPER | - | DUAL | DUAL | DUAL | UPPER |
| Base Number Matches | 1 | - | 1 | 1 | 1 | 1 |