CLC109AMC datasheet, PDF - EEWORLD Datasheet

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CLC109AMC: DescriptionLow-Power, Wideband, Closed-Loop Buffer; CategoryAnalog mixed-signal IC Amplifier circuit; File Size170KB，6 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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CLC109AMC Overview

Low-Power, Wideband, Closed-Loop Buffer

CLC109AMC Parametric

Parameter Name	Attribute value
Parts packaging code	WAFER
package instruction	DIE,
Reach Compliance Code	unknow
ECCN code	EAR99
Amplifier type	BUFFER
Maximum average bias current (IIB)	4 µA
Nominal bandwidth (3dB)	270 MHz
Maximum input offset voltage	5000 µV
JESD-30 code	X-XUUC-N4
Negative supply voltage upper limit	-7 V
Nominal Negative Supply Voltage (Vsup)	-5 V
Number of functions	1
Number of terminals	4
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Minimum output current	0.04 A
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	UNSPECIFIED
Package form	UNCASED CHIP
Certification status	Not Qualified
minimum slew rate	250 V/us
Nominal slew rate	350 V/us
Maximum slew rate	4 mA
Supply voltage upper limit	7 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	BIPOLAR
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal location	UPPER
Base Number Matches	1

CLC109AMC Related Products

	CLC109AMC	CLC109	CLC109AJE	CLC109AJM5	CLC109AJP	CLC109ALC
Description	Low-Power, Wideband, Closed-Loop Buffer	Low-Power, Wideband, Closed-Loop Buffer	Low-Power, Wideband, Closed-Loop Buffer	Low-Power, Wideband, Closed-Loop Buffer	Low-Power, Wideband, Closed-Loop Buffer	Low-Power, Wideband, Closed-Loop Buffer
Parts packaging code	WAFER	-	SOIC	SOT-23	DIP	WAFER
package instruction	DIE,	-	SOP, SOP8,.25	LSSOP, TSOP5/6,.11,37	DIP, DIP8,.3	DIE,
Reach Compliance Code	unknow	-	unknow	unknow	unknow	unknow
ECCN code	EAR99	-	EAR99	EAR99	EAR99	EAR99
Amplifier type	BUFFER	-	BUFFER	BUFFER	BUFFER	BUFFER
Maximum average bias current (IIB)	4 µA	-	4 µA	8 µA	4 µA	4 µA
Nominal bandwidth (3dB)	270 MHz	-	270 MHz	270 MHz	270 MHz	270 MHz
Maximum input offset voltage	5000 µV	-	5000 µV	8200 µV	5000 µV	5000 µV
JESD-30 code	X-XUUC-N4	-	R-PDSO-G8	R-PDSO-G5	R-PDIP-T8	X-XUUC-N4
Negative supply voltage upper limit	-7 V	-	-7 V	-7 V	-7 V	-7 V
Nominal Negative Supply Voltage (Vsup)	-5 V	-	-5 V	-5 V	-5 V	-5 V
Number of functions	1	-	1	1	1	1
Number of terminals	4	-	8	5	8	4
Maximum operating temperature	125 °C	-	85 °C	85 °C	85 °C	125 °C
Minimum operating temperature	-55 °C	-	-40 °C	-40 °C	-40 °C	-55 °C
Minimum output current	0.04 A	-	0.04 A	0.04 A	0.04 A	0.04 A
Package body material	UNSPECIFIED	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED
encapsulated code	DIE	-	SOP	LSSOP	DIP	DIE
Package shape	UNSPECIFIED	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	UNSPECIFIED
Package form	UNCASED CHIP	-	SMALL OUTLINE	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	IN-LINE	UNCASED CHIP
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
minimum slew rate	250 V/us	-	250 V/us	220 V/us	250 V/us	250 V/us
Nominal slew rate	350 V/us	-	350 V/us	350 V/us	350 V/us	350 V/us
Maximum slew rate	4 mA	-	4 mA	4 mA	4 mA	4 mA
Supply voltage upper limit	7 V	-	7 V	7 V	7 V	7 V
Nominal supply voltage (Vsup)	5 V	-	5 V	5 V	5 V	5 V
surface mount	YES	-	YES	YES	NO	YES
technology	BIPOLAR	-	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	MILITARY	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY
Terminal form	NO LEAD	-	GULL WING	GULL WING	THROUGH-HOLE	NO LEAD
Terminal location	UPPER	-	DUAL	DUAL	DUAL	UPPER
Base Number Matches	1	-	1	1	1	1
Contacts	-	-	8	5	8	4

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