SILICON GATE CMOS 32,768 WORD x 8 BIT STATIC RAM
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Toshiba Semiconductor |
| Parts packaging code | TSOP |
| package instruction | TSOP1, TSSOP28,.53,22 |
| Contacts | 28 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Maximum access time | 85 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-G28 |
| JESD-609 code | e0 |
| length | 11.8 mm |
| memory density | 262144 bi |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 32KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSOP1 |
| Encapsulate equivalent code | TSSOP28,.53,22 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Maximum standby current | 0.000015 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.07 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.55 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 8 mm |
| TC55257CFTI-85L | TC55257CTRI-10L | TC55257CTRI | TC55257CSPI-85L | TC55257CSPI | TC55257CSPI-10L | TC55257CPI-85L | TC55257CPI | TC55257CPI-10L | TC55257CFTI-10L | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | SILICON GATE CMOS 32,768 WORD x 8 BIT STATIC RAM | SILICON GATE CMOS 32,768 WORD x 8 BIT STATIC RAM | SILICON GATE CMOS 32,768 WORD x 8 BIT STATIC RAM | SILICON GATE CMOS 32,768 WORD x 8 BIT STATIC RAM | SILICON GATE CMOS 32,768 WORD x 8 BIT STATIC RAM | SILICON GATE CMOS 32,768 WORD x 8 BIT STATIC RAM | SILICON GATE CMOS 32,768 WORD x 8 BIT STATIC RAM | SILICON GATE CMOS 32,768 WORD x 8 BIT STATIC RAM | SILICON GATE CMOS 32,768 WORD x 8 BIT STATIC RAM | SILICON GATE CMOS 32,768 WORD x 8 BIT STATIC RAM |
| Is it lead-free? | Contains lead | Contains lead | - | Contains lead | - | Contains lead | Contains lead | - | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | - | incompatible | - | incompatible | incompatible | - | incompatible | incompatible |
| Parts packaging code | TSOP | TSOP | - | DIP | - | DIP | DIP | - | DIP | TSOP |
| package instruction | TSOP1, TSSOP28,.53,22 | TSOP1-R, TSSOP28,.53,22 | - | DIP, DIP28,.3 | - | DIP, DIP28,.3 | DIP, DIP28,.6 | - | DIP, DIP28,.6 | TSOP1, TSSOP28,.53,22 |
| Contacts | 28 | 28 | - | 28 | - | 28 | 28 | - | 28 | 28 |
| Reach Compliance Code | unknow | unknow | - | unknow | - | unknow | unknow | - | unknow | unknow |
| ECCN code | EAR99 | EAR99 | - | EAR99 | - | EAR99 | EAR99 | - | EAR99 | EAR99 |
| Maximum access time | 85 ns | 100 ns | - | 85 ns | - | 100 ns | 85 ns | - | 100 ns | 100 ns |
| I/O type | COMMON | COMMON | - | COMMON | - | COMMON | COMMON | - | COMMON | COMMON |
| JESD-30 code | R-PDSO-G28 | R-PDSO-G28 | - | R-PDIP-T28 | - | R-PDIP-T28 | R-PDIP-T28 | - | R-PDIP-T28 | R-PDSO-G28 |
| JESD-609 code | e0 | e0 | - | e0 | - | e0 | e0 | - | e0 | e0 |
| length | 11.8 mm | 11.8 mm | - | 34.9 mm | - | 34.9 mm | 37 mm | - | 37 mm | 11.8 mm |
| memory density | 262144 bi | 262144 bi | - | 262144 bi | - | 262144 bi | 262144 bi | - | 262144 bi | 262144 bi |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | - | STANDARD SRAM | - | STANDARD SRAM | STANDARD SRAM | - | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 | - | 8 | - | 8 | 8 | - | 8 | 8 |
| Number of functions | 1 | 1 | - | 1 | - | 1 | 1 | - | 1 | 1 |
| Number of terminals | 28 | 28 | - | 28 | - | 28 | 28 | - | 28 | 28 |
| word count | 32768 words | 32768 words | - | 32768 words | - | 32768 words | 32768 words | - | 32768 words | 32768 words |
| character code | 32000 | 32000 | - | 32000 | - | 32000 | 32000 | - | 32000 | 32000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | - | 85 °C | - | 85 °C | 85 °C | - | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | - | -40 °C | - | -40 °C | -40 °C | - | -40 °C | -40 °C |
| organize | 32KX8 | 32KX8 | - | 32KX8 | - | 32KX8 | 32KX8 | - | 32KX8 | 32KX8 |
| Output characteristics | 3-STATE | 3-STATE | - | 3-STATE | - | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSOP1 | TSOP1-R | - | DIP | - | DIP | DIP | - | DIP | TSOP1 |
| Encapsulate equivalent code | TSSOP28,.53,22 | TSSOP28,.53,22 | - | DIP28,.3 | - | DIP28,.3 | DIP28,.6 | - | DIP28,.6 | TSSOP28,.53,22 |
| Package shape | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | - | IN-LINE | - | IN-LINE | IN-LINE | - | IN-LINE | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL | - | PARALLEL | - | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 | 240 | - | 240 | - | 240 | 240 | - | 240 | 240 |
| power supply | 5 V | 5 V | - | 5 V | - | 5 V | 5 V | - | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| Maximum seat height | 1.2 mm | 1.2 mm | - | 4.45 mm | - | 4.45 mm | 5.3 mm | - | 5.3 mm | 1.2 mm |
| Maximum standby current | 0.000015 A | 0.000015 A | - | 0.000015 A | - | 0.000015 A | 0.000015 A | - | 0.000015 A | 0.000015 A |
| Minimum standby current | 2 V | 2 V | - | 2 V | - | 2 V | 2 V | - | 2 V | 2 V |
| Maximum slew rate | 0.07 mA | 0.07 mA | - | 0.07 mA | - | 0.07 mA | 0.07 mA | - | 0.07 mA | 0.07 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | - | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | - | 4.5 V | - | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | - | 5 V | - | 5 V | 5 V | - | 5 V | 5 V |
| surface mount | YES | YES | - | NO | - | NO | NO | - | NO | YES |
| technology | CMOS | CMOS | - | CMOS | - | CMOS | CMOS | - | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | - | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | GULL WING |
| Terminal pitch | 0.55 mm | 0.55 mm | - | 2.54 mm | - | 2.54 mm | 2.54 mm | - | 2.54 mm | 0.55 mm |
| Terminal location | DUAL | DUAL | - | DUAL | - | DUAL | DUAL | - | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| width | 8 mm | 8 mm | - | 7.62 mm | - | 7.62 mm | 15.24 mm | - | 15.24 mm | 8 mm |