4,194,304 WORD x 1 BIT DYNAMIC RAM
| TC514101AP | TC514101AZ-60 | TC514101AP-60 | TC514101ASJ-60 | TC514101AJ-60 | |
|---|---|---|---|---|---|
| Description | 4,194,304 WORD x 1 BIT DYNAMIC RAM | 4,194,304 WORD x 1 BIT DYNAMIC RAM | 4,194,304 WORD x 1 BIT DYNAMIC RAM | 4,194,304 WORD x 1 BIT DYNAMIC RAM | 4,194,304 WORD x 1 BIT DYNAMIC RAM |
| Is it lead-free? | - | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible |
| Maker | - | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | - |
| Parts packaging code | - | ZIP | DIP | SOJ | SOJ |
| package instruction | - | ZIP, | DIP, | SOJ, | SOJ, |
| Contacts | - | 20 | 18 | 20 | 20 |
| Reach Compliance Code | - | unknow | unknow | unknow | unknow |
| ECCN code | - | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | - | NIBBLE | NIBBLE | NIBBLE | NIBBLE |
| Maximum access time | - | 60 ns | 60 ns | 60 ns | 60 ns |
| Other features | - | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| JESD-30 code | - | R-PZIP-T20 | R-PDIP-T18 | R-PDSO-J20 | R-PDSO-J20 |
| JESD-609 code | - | e0 | e0 | e0 | e0 |
| length | - | 25.8 mm | 22 mm | 17.15 mm | 17.15 mm |
| memory density | - | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi |
| Memory IC Type | - | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM |
| memory width | - | 1 | 1 | 1 | 1 |
| Number of functions | - | 1 | 1 | 1 | 1 |
| Number of ports | - | 1 | 1 | 1 | 1 |
| Number of terminals | - | 20 | 18 | 20 | 20 |
| word count | - | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| character code | - | 4000000 | 4000000 | 4000000 | 4000000 |
| Operating mode | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | - | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | - | 4MX1 | 4MX1 | 4MX1 | 4MX1 |
| Output characteristics | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | ZIP | DIP | SOJ | SOJ |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | - | 1024 | 1024 | 1024 | 1024 |
| Maximum seat height | - | 10.16 mm | 4.4 mm | 3.75 mm | 3.75 mm |
| Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | 5 V |
| surface mount | - | NO | NO | YES | YES |
| technology | - | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
| Terminal pitch | - | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | - | ZIG-ZAG | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | - | - | 7.62 mm | 7.7 mm | 8.89 mm |
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