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TC514101ASJ-60

Description
4,194,304 WORD x 1 BIT DYNAMIC RAM
Categorystorage    storage   
File Size728KB,23 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Download Datasheet Parametric Compare View All

TC514101ASJ-60 Overview

4,194,304 WORD x 1 BIT DYNAMIC RAM

TC514101ASJ-60 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerToshiba Semiconductor
Parts packaging codeSOJ
package instructionSOJ,
Contacts20
Reach Compliance Codeunknow
ECCN codeEAR99
access modeNIBBLE
Maximum access time60 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 codeR-PDSO-J20
JESD-609 codee0
length17.15 mm
memory density4194304 bi
Memory IC TypeNIBBLE MODE DRAM
memory width1
Number of functions1
Number of ports1
Number of terminals20
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX1
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOJ
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
refresh cycle1024
Maximum seat height3.75 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.7 mm

TC514101ASJ-60 Related Products

TC514101ASJ-60 TC514101AZ-60 TC514101AP-60 TC514101AP TC514101AJ-60
Description 4,194,304 WORD x 1 BIT DYNAMIC RAM 4,194,304 WORD x 1 BIT DYNAMIC RAM 4,194,304 WORD x 1 BIT DYNAMIC RAM 4,194,304 WORD x 1 BIT DYNAMIC RAM 4,194,304 WORD x 1 BIT DYNAMIC RAM
Is it lead-free? Contains lead Contains lead Contains lead - Contains lead
Is it Rohs certified? incompatible incompatible incompatible - incompatible
Maker Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor - -
Parts packaging code SOJ ZIP DIP - SOJ
package instruction SOJ, ZIP, DIP, - SOJ,
Contacts 20 20 18 - 20
Reach Compliance Code unknow unknow unknow - unknow
ECCN code EAR99 EAR99 EAR99 - EAR99
access mode NIBBLE NIBBLE NIBBLE - NIBBLE
Maximum access time 60 ns 60 ns 60 ns - 60 ns
Other features RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH - RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 code R-PDSO-J20 R-PZIP-T20 R-PDIP-T18 - R-PDSO-J20
JESD-609 code e0 e0 e0 - e0
length 17.15 mm 25.8 mm 22 mm - 17.15 mm
memory density 4194304 bi 4194304 bi 4194304 bi - 4194304 bi
Memory IC Type NIBBLE MODE DRAM NIBBLE MODE DRAM NIBBLE MODE DRAM - NIBBLE MODE DRAM
memory width 1 1 1 - 1
Number of functions 1 1 1 - 1
Number of ports 1 1 1 - 1
Number of terminals 20 20 18 - 20
word count 4194304 words 4194304 words 4194304 words - 4194304 words
character code 4000000 4000000 4000000 - 4000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C - 70 °C
organize 4MX1 4MX1 4MX1 - 4MX1
Output characteristics 3-STATE 3-STATE 3-STATE - 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code SOJ ZIP DIP - SOJ
Package shape RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
Package form SMALL OUTLINE IN-LINE IN-LINE - SMALL OUTLINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified
refresh cycle 1024 1024 1024 - 1024
Maximum seat height 3.75 mm 10.16 mm 4.4 mm - 3.75 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V - 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V - 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V - 5 V
surface mount YES NO NO - YES
technology CMOS CMOS CMOS - CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL - COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Terminal form J BEND THROUGH-HOLE THROUGH-HOLE - J BEND
Terminal pitch 1.27 mm 1.27 mm 2.54 mm - 1.27 mm
Terminal location DUAL ZIG-ZAG DUAL - DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
width 7.7 mm - 7.62 mm - 8.89 mm
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