LMC6062IMX/NOPB datasheet, PDF

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LMC6062IMX/NOPB: DescriptionIC DUAL OP-AMP, 1300 uV OFFSET-MAX, 0.1 MHz BAND WIDTH, PDSO8, ROHS COMPLIANT, SOIC-8, Operational Amplifier; CategoryAnalog mixed-signal IC Amplifier circuit; File Size58KB，10 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com; Environmental Compliance

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LMC6062IMX/NOPB Overview

IC DUAL OP-AMP, 1300 uV OFFSET-MAX, 0.1 MHz BAND WIDTH, PDSO8, ROHS COMPLIANT, SOIC-8, Operational Amplifier

LMC6062IMX/NOPB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	National Semiconductor（TI ）
Parts packaging code	SOIC
package instruction	SOP, SOP8,.25
Contacts	8
Reach Compliance Code	compli
ECCN code	EAR99
Amplifier type	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK
Maximum average bias current (IIB)	0.000004 µA
Minimum Common Mode Rejection Ratio	63 dB
Nominal Common Mode Rejection Ratio	85 dB
frequency compensation	YES
Maximum input offset voltage	1300 µV
JESD-30 code	R-PDSO-G8
JESD-609 code	e3
length	4.9 mm
low-bias	YES
low-dissonance	NO
micropower	YES
Humidity sensitivity level	1
Negative supply voltage upper limit
Nominal Negative Supply Voltage (Vsup)
Number of functions	2
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
method of packing	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260
power supply	5/15 V
Certification status	Not Qualified
Maximum seat height	1.75 mm
minimum slew rate	0.007 V/us
Nominal slew rate	35000 V/us
Maximum slew rate	0.066 mA
Supply voltage upper limit	16 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
Nominal Uniform Gain Bandwidth	100 kHz
Minimum voltage gain	35000
width	3.9 mm

LMC6062IMX/NOPB Related Products

	LMC6062IMX/NOPB	LMC6062AIMX/NOPB	LMC6062IM/NOPB	LMC6062IN/NOPB
Description	IC DUAL OP-AMP, 1300 uV OFFSET-MAX, 0.1 MHz BAND WIDTH, PDSO8, ROHS COMPLIANT, SOIC-8, Operational Amplifier	IC DUAL OP-AMP, 900 uV OFFSET-MAX, 0.1 MHz BAND WIDTH, PDSO8, ROHS COMPLIANT, SOIC-8, Operational Amplifier	IC DUAL OP-AMP, 1300 uV OFFSET-MAX, 0.1 MHz BAND WIDTH, PDSO8, ROHS COMPLIANT, SOIC-8, Operational Amplifier	IC DUAL OP-AMP, 1300 uV OFFSET-MAX, 0.1 MHz BAND WIDTH, PDIP8, ROHS COMPLIANT, DIP-8, Operational Amplifier
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
Parts packaging code	SOIC	SOIC	SOIC	DIP
package instruction	SOP, SOP8,.25	SOP, SOP8,.25	SOP, SOP8,.25	DIP, DIP8,.3
Contacts	8	8	8	8
Reach Compliance Code	compli	compliant	compli	compli
ECCN code	EAR99	EAR99	EAR99	EAR99
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK
Maximum average bias current (IIB)	0.000004 µA	0.000004 µA	0.000004 µA	0.000004 µA
Minimum Common Mode Rejection Ratio	63 dB	72 dB	63 dB	63 dB
Nominal Common Mode Rejection Ratio	85 dB	85 dB	85 dB	85 dB
frequency compensation	YES	YES	YES	YES
Maximum input offset voltage	1300 µV	900 µV	1300 µV	1300 µV
JESD-30 code	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8
JESD-609 code	e3	e3	e3	e3
length	4.9 mm	4.9 mm	4.9 mm	9.817 mm
low-bias	YES	YES	YES	YES
low-dissonance	NO	YES	NO	NO
micropower	YES	YES	YES	YES
Humidity sensitivity level	1	1	1	1
Number of functions	2	2	2	2
Number of terminals	8	8	8	8
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	SOP	DIP
Encapsulate equivalent code	SOP8,.25	SOP8,.25	SOP8,.25	DIP8,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
method of packing	TAPE AND REEL	TAPE AND REEL	RAIL	RAIL
Peak Reflow Temperature (Celsius)	260	260	260	260
power supply	5/15 V	5/15 V	5/15 V	5/15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.75 mm	1.75 mm	1.75 mm	5.08 mm
minimum slew rate	0.007 V/us	0.01 V/us	0.007 V/us	0.007 V/us
Nominal slew rate	35000 V/us	35000 V/us	35000 V/us	35000 V/us
Maximum slew rate	0.066 mA	0.055 mA	0.066 mA	0.066 mA
Supply voltage upper limit	16 V	16 V	16 V	16 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
Terminal form	GULL WING	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	40	40	40	40
Nominal Uniform Gain Bandwidth	100 kHz	100 kHz	100 kHz	100 kHz
Minimum voltage gain	35000	50000	35000	35000
width	3.9 mm	3.9 mm	3.9 mm	7.62 mm

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