|
LMC6062IN/NOPB |
LMC6062AIMX/NOPB |
LMC6062IM/NOPB |
LMC6062IMX/NOPB |
| Description |
IC DUAL OP-AMP, 1300 uV OFFSET-MAX, 0.1 MHz BAND WIDTH, PDIP8, ROHS COMPLIANT, DIP-8, Operational Amplifier |
IC DUAL OP-AMP, 900 uV OFFSET-MAX, 0.1 MHz BAND WIDTH, PDSO8, ROHS COMPLIANT, SOIC-8, Operational Amplifier |
IC DUAL OP-AMP, 1300 uV OFFSET-MAX, 0.1 MHz BAND WIDTH, PDSO8, ROHS COMPLIANT, SOIC-8, Operational Amplifier |
IC DUAL OP-AMP, 1300 uV OFFSET-MAX, 0.1 MHz BAND WIDTH, PDSO8, ROHS COMPLIANT, SOIC-8, Operational Amplifier |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
| Maker |
National Semiconductor（TI ） |
National Semiconductor（TI ） |
National Semiconductor（TI ） |
National Semiconductor（TI ） |
| Parts packaging code |
DIP |
SOIC |
SOIC |
SOIC |
| package instruction |
DIP, DIP8,.3 |
SOP, SOP8,.25 |
SOP, SOP8,.25 |
SOP, SOP8,.25 |
| Contacts |
8 |
8 |
8 |
8 |
| Reach Compliance Code |
compli |
compliant |
compli |
compli |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Amplifier type |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
| Architecture |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) |
0.000004 µA |
0.000004 µA |
0.000004 µA |
0.000004 µA |
| Minimum Common Mode Rejection Ratio |
63 dB |
72 dB |
63 dB |
63 dB |
| Nominal Common Mode Rejection Ratio |
85 dB |
85 dB |
85 dB |
85 dB |
| frequency compensation |
YES |
YES |
YES |
YES |
| Maximum input offset voltage |
1300 µV |
900 µV |
1300 µV |
1300 µV |
| JESD-30 code |
R-PDIP-T8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
| JESD-609 code |
e3 |
e3 |
e3 |
e3 |
| length |
9.817 mm |
4.9 mm |
4.9 mm |
4.9 mm |
| low-bias |
YES |
YES |
YES |
YES |
| low-dissonance |
NO |
YES |
NO |
NO |
| micropower |
YES |
YES |
YES |
YES |
| Humidity sensitivity level |
1 |
1 |
1 |
1 |
| Number of functions |
2 |
2 |
2 |
2 |
| Number of terminals |
8 |
8 |
8 |
8 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
DIP |
SOP |
SOP |
SOP |
| Encapsulate equivalent code |
DIP8,.3 |
SOP8,.25 |
SOP8,.25 |
SOP8,.25 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
| method of packing |
RAIL |
TAPE AND REEL |
RAIL |
TAPE AND REEL |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
| power supply |
5/15 V |
5/15 V |
5/15 V |
5/15 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
5.08 mm |
1.75 mm |
1.75 mm |
1.75 mm |
| minimum slew rate |
0.007 V/us |
0.01 V/us |
0.007 V/us |
0.007 V/us |
| Nominal slew rate |
35000 V/us |
35000 V/us |
35000 V/us |
35000 V/us |
| Maximum slew rate |
0.066 mA |
0.055 mA |
0.066 mA |
0.066 mA |
| Supply voltage upper limit |
16 V |
16 V |
16 V |
16 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
| surface mount |
NO |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
| Terminal form |
THROUGH-HOLE |
GULL WING |
GULL WING |
GULL WING |
| Terminal pitch |
2.54 mm |
1.27 mm |
1.27 mm |
1.27 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
40 |
40 |
40 |
40 |
| Nominal Uniform Gain Bandwidth |
100 kHz |
100 kHz |
100 kHz |
100 kHz |
| Minimum voltage gain |
35000 |
50000 |
35000 |
35000 |
| width |
7.62 mm |
3.9 mm |
3.9 mm |
3.9 mm |
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