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LMC6062AIMX/NOPB

Description
IC DUAL OP-AMP, 900 uV OFFSET-MAX, 0.1 MHz BAND WIDTH, PDSO8, ROHS COMPLIANT, SOIC-8, Operational Amplifier
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size58KB,10 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Environmental Compliance
Stay tuned Parametric Compare

LMC6062AIMX/NOPB Overview

IC DUAL OP-AMP, 900 uV OFFSET-MAX, 0.1 MHz BAND WIDTH, PDSO8, ROHS COMPLIANT, SOIC-8, Operational Amplifier

LMC6062AIMX/NOPB Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNational Semiconductor(TI )
Parts packaging codeSOIC
package instructionSOP, SOP8,.25
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
Amplifier typeOPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACK
Maximum average bias current (IIB)0.000004 µA
Minimum Common Mode Rejection Ratio72 dB
Nominal Common Mode Rejection Ratio85 dB
frequency compensationYES
Maximum input offset voltage900 µV
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.9 mm
low-biasYES
low-dissonanceYES
micropowerYES
Humidity sensitivity level1
Negative supply voltage upper limit
Nominal Negative Supply Voltage (Vsup)
Number of functions2
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply5/15 V
Certification statusNot Qualified
Maximum seat height1.75 mm
minimum slew rate0.01 V/us
Nominal slew rate35000 V/us
Maximum slew rate0.055 mA
Supply voltage upper limit16 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
Nominal Uniform Gain Bandwidth100 kHz
Minimum voltage gain50000
width3.9 mm

LMC6062AIMX/NOPB Related Products

LMC6062AIMX/NOPB LMC6062IM/NOPB LMC6062IN/NOPB LMC6062IMX/NOPB
Description IC DUAL OP-AMP, 900 uV OFFSET-MAX, 0.1 MHz BAND WIDTH, PDSO8, ROHS COMPLIANT, SOIC-8, Operational Amplifier IC DUAL OP-AMP, 1300 uV OFFSET-MAX, 0.1 MHz BAND WIDTH, PDSO8, ROHS COMPLIANT, SOIC-8, Operational Amplifier IC DUAL OP-AMP, 1300 uV OFFSET-MAX, 0.1 MHz BAND WIDTH, PDIP8, ROHS COMPLIANT, DIP-8, Operational Amplifier IC DUAL OP-AMP, 1300 uV OFFSET-MAX, 0.1 MHz BAND WIDTH, PDSO8, ROHS COMPLIANT, SOIC-8, Operational Amplifier
Is it Rohs certified? conform to conform to conform to conform to
Maker National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI )
Parts packaging code SOIC SOIC DIP SOIC
package instruction SOP, SOP8,.25 SOP, SOP8,.25 DIP, DIP8,.3 SOP, SOP8,.25
Contacts 8 8 8 8
Reach Compliance Code compliant compli compli compli
ECCN code EAR99 EAR99 EAR99 EAR99
Amplifier type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Maximum average bias current (IIB) 0.000004 µA 0.000004 µA 0.000004 µA 0.000004 µA
Minimum Common Mode Rejection Ratio 72 dB 63 dB 63 dB 63 dB
Nominal Common Mode Rejection Ratio 85 dB 85 dB 85 dB 85 dB
frequency compensation YES YES YES YES
Maximum input offset voltage 900 µV 1300 µV 1300 µV 1300 µV
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 R-PDSO-G8
JESD-609 code e3 e3 e3 e3
length 4.9 mm 4.9 mm 9.817 mm 4.9 mm
low-bias YES YES YES YES
low-dissonance YES NO NO NO
micropower YES YES YES YES
Humidity sensitivity level 1 1 1 1
Number of functions 2 2 2 2
Number of terminals 8 8 8 8
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP DIP SOP
Encapsulate equivalent code SOP8,.25 SOP8,.25 DIP8,.3 SOP8,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE
method of packing TAPE AND REEL RAIL RAIL TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 260 260 260
power supply 5/15 V 5/15 V 5/15 V 5/15 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.75 mm 1.75 mm 5.08 mm 1.75 mm
minimum slew rate 0.01 V/us 0.007 V/us 0.007 V/us 0.007 V/us
Nominal slew rate 35000 V/us 35000 V/us 35000 V/us 35000 V/us
Maximum slew rate 0.055 mA 0.066 mA 0.066 mA 0.066 mA
Supply voltage upper limit 16 V 16 V 16 V 16 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES YES NO YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
Terminal form GULL WING GULL WING THROUGH-HOLE GULL WING
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 40 40 40
Nominal Uniform Gain Bandwidth 100 kHz 100 kHz 100 kHz 100 kHz
Minimum voltage gain 50000 35000 35000 35000
width 3.9 mm 3.9 mm 7.62 mm 3.9 mm
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