CXK59290M-10L datasheet, PDF - EEWORLD Datasheet

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CXK59290M-10L: DescriptionStandard SRAM, 32KX9, 100ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32; Categorystorage storage; File Size233KB，11 Pages; ManufacturerSONY; Websitehttp://www.sony.co.jp

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CXK59290M-10L Overview

Standard SRAM, 32KX9, 100ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32

CXK59290M-10L Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	SONY
Parts packaging code	SOIC
package instruction	SOP, SOP32,.5
Contacts	32
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	100 ns
I/O type	COMMON
JESD-30 code	R-PDSO-G32
JESD-609 code	e0
length	20.5 mm
memory density	294912 bi
Memory IC Type	STANDARD SRAM
memory width	9
Number of functions	1
Number of ports	1
Number of terminals	32
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX9
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP32,.5
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	2.7 mm
Maximum standby current	0.00001 A
Minimum standby current	2 V
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8.4 mm

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CXK59290M-10L Related Products

	CXK59290M-10L	CXK59290TM-12L	CXK59290M-70L	CXK59290TM-70L	CXK59290TM-10L	CXK59290M-12L
Description	Standard SRAM, 32KX9, 100ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32	Standard SRAM, 32KX9, 120ns, CMOS, PDSO32, 8 X 20 MM, EIAJ, PLASTIC, TSOP-32	Standard SRAM, 32KX9, 70ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32	Standard SRAM, 32KX9, 70ns, CMOS, PDSO32, 8 X 20 MM, EIAJ, PLASTIC, TSOP-32	Standard SRAM, 32KX9, 100ns, CMOS, PDSO32, 8 X 20 MM, EIAJ, PLASTIC, TSOP-32	Standard SRAM, 32KX9, 120ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	SONY	SONY	SONY	SONY	SONY	SONY
Parts packaging code	SOIC	TSOP	SOIC	TSOP	TSOP	SOIC
package instruction	SOP, SOP32,.5	TSOP1, TSSOP32,.8,20	SOP, SOP32,.5	TSOP1, TSSOP32,.8,20	TSOP1, TSSOP32,.8,20	SOP, SOP32,.5
Contacts	32	32	32	32	32	32
Reach Compliance Code	unknow	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	100 ns	120 ns	70 ns	70 ns	100 ns	120 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32
JESD-609 code	e0	e0	e0	e0	e0	e0
length	20.5 mm	18.4 mm	20.5 mm	18.4 mm	18.4 mm	20.5 mm
memory density	294912 bi	294912 bit	294912 bit	294912 bit	294912 bit	294912 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32
word count	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	32KX9	32KX9	32KX9	32KX9	32KX9	32KX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	TSOP1	SOP	TSOP1	TSOP1	SOP
Encapsulate equivalent code	SOP32,.5	TSSOP32,.8,20	SOP32,.5	TSSOP32,.8,20	TSSOP32,.8,20	SOP32,.5
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.7 mm	1.2 mm	2.7 mm	1.2 mm	1.2 mm	2.7 mm
Maximum standby current	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A
Minimum standby current	2 V	2 V	2 V	2 V	2 V	2 V
Maximum slew rate	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	0.5 mm	1.27 mm	0.5 mm	0.5 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	8.4 mm	8 mm	8.4 mm	8 mm	8 mm	8.4 mm

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