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5962-9080308MLA

Description
OTP ROM, 8KX8, 25ns, CMOS, CDIP24, CERAMIC, DIP-24
Categorystorage    storage   
File Size66KB,16 Pages
ManufacturerDefense Logistics Agency
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5962-9080308MLA Overview

OTP ROM, 8KX8, 25ns, CMOS, CDIP24, CERAMIC, DIP-24

5962-9080308MLA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerDefense Logistics Agency
Parts packaging codeDIP
package instructionDIP, DIP24,.3
Contacts24
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time25 ns
I/O typeCOMMON
JESD-30 codeR-GDIP-T24
JESD-609 codee0
memory density65536 bi
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals24
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize8KX8
Output characteristics3-STATE
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusQualified
Filter levelMIL-STD-883
Maximum standby current0.05 A
Maximum slew rate0.14 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb) - hot dipped
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
REVISIONS
LTR
A
DESCRIPTION
Update drawing to reflect current requirements. Editorial changes throughout. -
gap
DATE (YR-MO-DA)
01-02-15
APPROVED
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
Gary L. Gross
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
A
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Ray Monnin
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
92-07-20
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
MICROCIRCUIT, MEMORY, DIGITAL, CMOS
8K X 8-BIT PROM, MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
A
SIZE
A
SHEET
CAGE CODE
67268
1 OF
14
5962-90803
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E190-01

5962-9080308MLA Related Products

5962-9080308MLA 5962-9080308MJA 5962-9080308M3A 5962-9080304M3A 5962-9080308MKA 5962-9080304MKA
Description OTP ROM, 8KX8, 25ns, CMOS, CDIP24, CERAMIC, DIP-24 OTP ROM, 8KX8, 25ns, CMOS, CDIP24, 0.600 INCH, CERDIP-24 OTP ROM, 8KX8, 25ns, CMOS, CQCC28, CERAMIC, LCC-28 OTP ROM, 8KX8, 25ns, CMOS, CQCC28, CERAMIC, LCC-28 OTP ROM, 8KX8, 25ns, CMOS, CDFP24, CERAMIC, FP-24 OTP ROM, 8KX8, 25ns, CMOS, CDFP24, CERAMIC, FP-24
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code DIP DIP QLCC QLCC DFP DFP
package instruction DIP, DIP24,.3 DIP, DIP24,.6 QCCN, LCC28,.45SQ QCCN, LCC28,.45SQ DFP, FL24,.4 DFP, FL24,.4
Contacts 24 24 28 28 24 24
Reach Compliance Code unknow unknow unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 25 ns 25 ns 25 ns 25 ns 25 ns 25 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-GDIP-T24 R-XDIP-T24 S-CQCC-N28 S-XQCC-N28 R-GDFP-F24 R-GDFP-F24
JESD-609 code e0 e0 e0 e0 e0 e0
memory density 65536 bi 65536 bi 65536 bit 65536 bit 65536 bit 65536 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 24 24 28 28 24 24
word count 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000 8000 8000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code DIP DIP QCCN QCCN DFP DFP
Encapsulate equivalent code DIP24,.3 DIP24,.6 LCC28,.45SQ LCC28,.45SQ FL24,.4 FL24,.4
Package shape RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Qualified Qualified Qualified Qualified Qualified Qualified
Filter level MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883
Maximum standby current 0.05 A 0.05 A 0.05 A 0.05 A 0.05 A 0.05 A
Maximum slew rate 0.14 mA 0.14 mA 0.14 mA 0.14 mA 0.14 mA 0.14 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped
Terminal form THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD FLAT FLAT
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL QUAD QUAD DUAL DUAL
Base Number Matches - 1 1 1 1 1
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