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FCSP140LTR

Description
1 A, 40 V, SILICON, SIGNAL DIODE
CategoryDiscrete semiconductor    diode   
File Size115KB,6 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
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FCSP140LTR Overview

1 A, 40 V, SILICON, SIGNAL DIODE

FCSP140LTR Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerVishay
package instructionR-PBGA-B4
Contacts4
Reach Compliance Codeunknow
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)0.38 V
JESD-30 codeR-PBGA-B4
Maximum non-repetitive peak forward current21 A
Number of components1
Number of terminals4
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Maximum output current1 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum repetitive peak reverse voltage40 V
surface mountYES
technologySCHOTTKY
Terminal formBALL
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
VS-FCSP140LTR
www.vishay.com
Vishay Semiconductors
FlipKY
®
,
1 A Chip Scale Package Schottky Barrier Rectifier
FEATURES
• Ultra low V
F
per footprint area
• Low leakage
• Low thermal resistance
• One-fifth footprint of SMA
• Super low profile (0.6 mm)
• Available tested on tape and reel
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
FlipKY
®
• Reverse polarity protection
• Current steering
• Freewheeling
• Flyback
• Oring
DESCRIPTION
PRODUCT SUMMARY
I
F(AV)
V
R
V
F
at I
F
I
RM
max. at 25 °C
I
RM
max. at 125 °C
T
J
max.
E
AS
1A
40 V
0.38 V
80 μA
20 mA
150 °C
10 mJ
Vishay’s FlipKY
®
product family utilizes wafer level
chip scale packaging to deliver Schottky diodes with the
lowest V
F
to PCB footprint area in industry. The four
bump 1.5 mm x 1.5 mm devices can deliver up to 1 A and
occupy only 2.3 mm
2
of board space. The anode and
cathode connections are made through solder bump pads
on one side of the silicon enabling designers to strategically
place the diodes on the PCB. This design not only minimizes
board space but also reduces thermal resistance and
inductance, which can improve overall circuit efficiency.
Typical applications include hand-held, portable equipment
such as cell phones, MP3 players, bluetooth, GPS, PDAs,
and portable hard disk drives where space savings and
performance are crucial.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
V
RRM
I
F(AV)
I
FSM
V
F
T
J
1 A
pk
, T
J
= 125 °C
Rectangular waveform
CHARACTERISTICS
MAX.
40
1
250
0.38
- 55 to 150
UNITS
V
A
V
°C
VOLTAGE RATINGS
PARAMETER
Maximum DC reverse voltage
Maximum working peak reverse voltage
SYMBOL
V
R
V
RWM
VS-FCSP140LTR
40
UNITS
V
Revision: 04-Jul-11
Document Number: 94495
1
For technical questions within your region:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000

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