Microwave Ceramics and Modules
2-Pole Filter for W-LAN
Preliminary datasheet
Filter
B69812N2457G301
Features
•
SMD filter consisting of coupled resonators with stepped impedances
•
extreme low losses
•
high attenuations at GSM (900, 1800) and UMTS bands
•
high attenuation a 2 times center frequency
•
(NdBa)TiO3 (εr = 88 /
TCf
=0±10 ppm/K) with a coating of copper (10µm) and tin (>5µm)
•
Excellent reflow solderability, no migration effect due to copper/tin metallization
Index
Page 2
Component drawing
Recommended footprint
Page 3
Characteristics
Maximum ratings
Typical passband characteristic
Page 4
Processing information
Soldering requirements
Delivery mode
ISSUE DATE
27.08.03
ISSUE
P1
PUBLISHER
SAW MWC PD F
PAGE
1/4
Microwave Ceramics and Modules
2-Pole Filter for W-LAN
Preliminary datasheet
Component drawing
Filter
B69812N2457G301
View from below onto the solder terminals and view from beside
Recommended footprint
I/O
G
I/O
soldered areas
G
G
G
I/O Pads must be terminated with
50
Ω
characteristic impedance
FPS2D
ISSUE DATE
27.08.03
ISSUE
P1
PUBLISHER
SAW MWC PD F
PAGE
2/4
Microwave Ceramics and Modules
2-Pole Filter for W-LAN
Preliminary datasheet
Characteristics
min.
typ.
Filter
B69812N2457G301
max.
Center frequency
Insertion loss
Passband
Amplitude ripple (peak - peak)
Standing wave ratio
Impedance
Attenuation
at 2150 MHz
Maximum ratings
f
c -
2.45
0.8
-
1.2
GHz
dB
MHz
α
IL
B
100
∆α
SWR
Z
0.4
1.5
50
0.8
2.0
dB
Ω
25
30
IEC climatic category (IEC 68-1)
Operating temperature
Typical passband characteristic
- 40/+ 90/56
T
op - 20 / + 85
°C
S2I211 DOC
2,000
2,040
2,080
2,120
2,160
2,200
2,240
2,280
2,320
2,360
2,400
2,440
2,480
2,520
2,560
2,600
2,640
2,680
2,720
2,760
0
-5
-10
-15
Attenuation [dB]
-20
-25
-30
-35
-40
-45
-50
-55
-60
Frequency [GHz]
S11 [dB]
S21 [dB]
ISSUE DATE
27.08.03
ISSUE
P1
PUBLISHER
SAW MWC PD F
2,800
PAGE
3/4
Microwave Ceramics and Modules
2-Pole Filter for W-LAN
Preliminary datasheet
Processing information
Filter
B69812N2457G301
ZNr.: 527 (FILT95_2)
Wettability to IEC 68-2-58:
≥
75% (after aging)
Soldering requirements
Soldering type
Maximum soldering temperature
(measuring point on top surface of the component)
Recommended soldering conditions (infrared):
Temp. [°C]
within 10 sec.
reflow
235 (max. 2 sec.)
225 (max. 10 sec.)
°C
°C
215°C±10°C
20-40 sec.
40-80 sec.
Time [sec.]
LOETPROF.DOC
Delivery mode
Blister tape to IEC 286-3, PS, grey
Pieces/tape: 3000
Profile B-B:
Reel: diamerter - 330mm
Profile A-A:
8▒0.1
A
1.9▒0.1
12▒0.3
B
5.5▒0.05
2▒0.05
4▒0.1
A
10x4(=40▒0.2)
B
1.75▒0.1
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto
and the information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed
characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the
Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers'
Association), unless otherwise agreed.
ISSUE DATE
27.08.03
ISSUE
P1
PUBLISHER
SAW MWC PD F
PAGE
4/4
TAPS2I1 DOC
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