MC74HC30J datasheet, PDF - EEWORLD Datasheet

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MC74HC30J: DescriptionIC,LOGIC GATE,8-INPUT NAND,HC-CMOS,DIP,14PIN,CERAMIC; Categorylogic logic; File Size145KB，3 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC74HC30J Overview

IC,LOGIC GATE,8-INPUT NAND,HC-CMOS,DIP,14PIN,CERAMIC

MC74HC30J Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP14,.3
Reach Compliance Code	unknow
JESD-30 code	R-XDIP-T14
JESD-609 code	e0
Logic integrated circuit type	NAND GATE
Number of terminals	14
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
Certification status	Not Qualified
Schmitt trigger	NO
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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MC74HC30J Related Products

	MC74HC30J	54HC30M/B2AJC	54HC30/BCAJC	MC74HC30DS	MC74HC30DD	MC74HC30NDS
Description	IC,LOGIC GATE,8-INPUT NAND,HC-CMOS,DIP,14PIN,CERAMIC	IC,LOGIC GATE,8-INPUT NAND,HC-CMOS,LLCC,20PIN,CERAMIC	IC,LOGIC GATE,8-INPUT NAND,HC-CMOS,DIP,14PIN,CERAMIC	IC,LOGIC GATE,8-INPUT NAND,HC-CMOS,SOP,14PIN,PLASTIC	IC,LOGIC GATE,8-INPUT NAND,HC-CMOS,SOP,14PIN,PLASTIC	IC,LOGIC GATE,8-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC
Maker	NXP	NXP	NXP	NXP	NXP	NXP
package instruction	DIP, DIP14,.3	QCCN, LCC20,.35SQ	DIP,	SOP, SOP14,.25	SOP, SOP14,.25	DIP, DIP14,.3
Reach Compliance Code	unknow	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T14	S-XQCC-N20	R-CDIP-T14	R-PDSO-G14	R-PDSO-G14	R-PDIP-T14
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE
Number of terminals	14	20	14	14	14	14
Maximum operating temperature	85 °C	125 °C	125 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC	CERAMIC	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	QCCN	DIP	SOP	SOP	DIP
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
surface mount	NO	YES	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE
Terminal location	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL
Is it Rohs certified?	incompatible	incompatible	-	incompatible	incompatible	incompatible
JESD-609 code	e0	e0	-	e0	e0	e0
Encapsulate equivalent code	DIP14,.3	LCC20,.35SQ	-	SOP14,.25	SOP14,.25	DIP14,.3
power supply	2/6 V	2/6 V	-	2/6 V	2/6 V	2/6 V
Schmitt trigger	NO	NO	-	NO	NO	NO
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal pitch	2.54 mm	1.27 mm	-	1.27 mm	1.27 mm	2.54 mm

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