54HC30/BCAJC datasheet, PDF - EEWORLD Datasheet

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54HC30/BCAJC: DescriptionIC,LOGIC GATE,8-INPUT NAND,HC-CMOS,DIP,14PIN,CERAMIC; Categorylogic logic; File Size145KB，3 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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54HC30/BCAJC Overview

IC,LOGIC GATE,8-INPUT NAND,HC-CMOS,DIP,14PIN,CERAMIC

54HC30/BCAJC Parametric

Parameter Name	Attribute value
Maker	NXP
Parts packaging code	DIP
package instruction	DIP,
Contacts	14
Reach Compliance Code	unknown
series	HC/UH
JESD-30 code	R-CDIP-T14
Logic integrated circuit type	NAND GATE
Number of functions	1
Number of entries	8
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal location	DUAL
Base Number Matches	1

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54HC30/BCAJC Related Products

	54HC30/BCAJC	54HC30M/B2AJC	MC74HC30DS	MC74HC30DD	MC74HC30NDS	MC74HC30J
Description	IC,LOGIC GATE,8-INPUT NAND,HC-CMOS,DIP,14PIN,CERAMIC	IC,LOGIC GATE,8-INPUT NAND,HC-CMOS,LLCC,20PIN,CERAMIC	IC,LOGIC GATE,8-INPUT NAND,HC-CMOS,SOP,14PIN,PLASTIC	IC,LOGIC GATE,8-INPUT NAND,HC-CMOS,SOP,14PIN,PLASTIC	IC,LOGIC GATE,8-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC	IC,LOGIC GATE,8-INPUT NAND,HC-CMOS,DIP,14PIN,CERAMIC
Maker	NXP	NXP	NXP	NXP	NXP	NXP
package instruction	DIP,	QCCN, LCC20,.35SQ	SOP, SOP14,.25	SOP, SOP14,.25	DIP, DIP14,.3	DIP, DIP14,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknow
JESD-30 code	R-CDIP-T14	S-XQCC-N20	R-PDSO-G14	R-PDSO-G14	R-PDIP-T14	R-XDIP-T14
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE
Number of terminals	14	20	14	14	14	14
Maximum operating temperature	125 °C	125 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	QCCN	SOP	SOP	DIP	DIP
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE
surface mount	NO	YES	YES	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	NO LEAD	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal location	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	incompatible
JESD-609 code	-	e0	e0	e0	e0	e0
Encapsulate equivalent code	-	LCC20,.35SQ	SOP14,.25	SOP14,.25	DIP14,.3	DIP14,.3
power supply	-	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V
Schmitt trigger	-	NO	NO	NO	NO	NO
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal pitch	-	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm

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