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CHP21006041FLF

Description
Fixed Resistor, Metal Glaze/thick Film, 2W, 6040ohm, 500V, 1% +/-Tol, 100ppm/Cel,
CategoryPassive components    The resistor   
File Size364KB,4 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance
Download Datasheet Parametric View All

CHP21006041FLF Overview

Fixed Resistor, Metal Glaze/thick Film, 2W, 6040ohm, 500V, 1% +/-Tol, 100ppm/Cel,

CHP21006041FLF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerTT Electronics plc
Reach Compliance Codecompli
ECCN codeEAR99
structureCylindrical
JESD-609 codee1
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Package diameter2.67 mm
Package length9.32 mm
Package shapeCYLINDRICAL PACKAGE
Package formMELF
method of packingTR, 13 INCH
Rated power dissipation(P)2 W
Rated temperature25 °C
GuidelineAEC-Q200
resistance6040 Ω
Resistor typeFIXED RESISTOR
size code3610
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu) - hot dipped
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage500 V
Cylindrical High Power
Surface Mount Metal Glaze™
CHP Series
·
0.2 ohm to 2.2 megohm range
·
RoHS-compliant version available
Up to 2 watts
·
150°C maximum operating temperature
Up to 1000 volts
0.2 ohm to 2.2 megohm range
RoHS-compliant version available
150°C maximum operating temperature
Cylindrical High Power
·
Up to 2 watts
·
Surface Mount Metal Glaze
TM
Up to 1000 volts
CHP
Metal Glaze™
thick fi lm element
fi red at 1000°C
to solid ceramic
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
Solder over
nickel barrier
Solder over
nickel barrier
High
temperature
dielectric
coating
High
temperature
dielectric
coating
Electrical Data
IRC
Type
Indus-
try
Foot-
print
1206
Size
Code1
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
0.1 to 0.99
CHP 1/8
B&C
1/4W @ 70°C
200
400
1.0 to 1.0 M
20 to 348K
CHP 1/2
2010
D&E
1/2W @ 70°C
300
600
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
CHP 1
2512
F
1W @ 70°C
350
700
1.0 to 2.21M
20 to 348K
CHP 2
3610
H
2W @ 25°C
1.33W @ 70°C
500
1000
0.2 to 0.99
1.0 to 2.21M
²Not to exceed
P x R
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
Tolerance
(±%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
¹See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging.
³Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
teristics
Charac
Thermal Shock
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Maximum
m Change
Maximu
Change
±0.25% +.01 Ω
As specified
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.25% + 0.01 ohm
±0.5% +.01 Ω
Test Method
MIL-PRF-55342H, §4.8.3
Test Method
MIL-R-55342H Par 3.16 (-55°C +
+150°C / -65°C)
(MIL-STD-202, Method 107G:
125°C)
MIL-PRF-55342H, §4.8.5
MIL-R-55342H Par 3.9 (-65°C + 150°C, 5 cycles)
(-65°C)
MIL-R-55342H Par 3.11 (-65°C @ working voltage)
MIL-R-55342H Par 3.12
2.5 x
P x R
for 5 seconds
MIL-PRF-55342H, §4.8.7
MIL-R-55342H Par 3.13 (-150°C for 100 hours)
MIL-R-55342H Par 3.14.2 (
Reflow soldered to board at 260°C for 10 seconds
)
MIL-PRF-55342H, §4.8.8.2
Short Time Overload
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
±1%
+ 0.01 ohm
±0.5%
for R>100KΩ
±1% for R>100K ohm
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
MIL-PRF-55342H, §4.8.6
(150°C x 100 Hours)
Resistance to Bonding Exposure
Moisture Resistance
Solderability
High Temperature Exposure
±0.5% +.01 Ω
±0.25% +.01 Ω
±0.5% +.01 Ω
As specified
MIL-PRF-55342H, §4.8.8.2
95% minimum coverage
±0.5% + 0.01 ohm
Temperature Coefficient
Life Test
Resistance
Moisture
Life Test
Solderability
Terminal Adhesion Strength
MIL-PRF-55342H, §4.8.10
(MIL-STD-202, Method 304)
MIL-R-55342H Par 3.18 (10 cycles, total 240 hours)
MIL-R-55342H Par 3.15 (2000 hours at 70°C intermittent)
(MIL-STD-202, Method 108A: 2000 Hours @ 70°C)
1200 gram push from underside of mounted chip for 60 seconds
(MIL-STD-202, Method 208H)
MIL-STD-202, Method 208 (245°C for 5 seconds)
(MIL-STD-202, Method 106G)
±1%
+ 0.01
±0.5%
+.01 Ω
ohm
±1% +
minimum coverage
95%
0.01 ohm
no mechanical damage
MIL-PRF-55342H, §4.8.11
MIL-PRF-55342H, §4.8.12
±1% +.01 Ω
IRC – defined
Chip mounted in center of 90mm long board, deflected 1mm so as to
Terminal Adhesion Strength (push)
±1% + 0.01 ohm
(no mechanical damage)
exert pull on chip contacts for 5 seconds
1200 gram push from underside of mounted device for 60 sec
no mechanical damage
IRC-defined
±1% +.01 Ω
General Note
Terminal Adhesion Strength (flex)
cation without notice or liability.
Device mounted in center of 90mm long board, deflected 1 mm to exert
IRC reserves the right to make changes in product specifi
(no mechanical damage)
All information is subject to IRC’s own data and is considered accurate at time of going to print.
pull on contacts for 5 seconds
A subsidiary of
© IRC Wire and Film Technologies Division
• 4222 South Staples Street • Corpus
Christi Texas
78411 USA
TT electronics plc
General Note
Telephone:
361 992 7900 •
Facsimile:
361 992 3377 •
Website: www.irctt.com
CHP Series
Issue March
2011 Sheet 1 of 3
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
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