AM29F160DT90 datasheet, PDF - EEWORLD Datasheet

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AM29F160DT90: Description1M X 16 FLASH 5V PROM, 70 ns, PDSO48; Categorystorage; File Size532KB，46 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM29F160DT90 Overview

1M X 16 FLASH 5V PROM, 70 ns, PDSO48

AM29F160DT90 Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	48
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Maximum supply/operating voltage	5.25 V
Minimum supply/operating voltage	4.75 V
Rated supply voltage	5 V
maximum access time	70 ns
Processing package description	MO-142(B)DD, PLASTIC, TSOP -48
state	ACTIVE-UNCONFIRMED
Craftsmanship	CMOS
packaging shape	RECTANGULAR
Package Size	SMALL OUTLINE, THIN PROFILE
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	0.5000 mm
terminal coating	TIN LEAD
Terminal location	DUAL
Packaging Materials	PLASTIC/EPOXY
Temperature level	INDUSTRIAL
memory width	16
organize	1M X 16
storage density	1.68E7 deg
operating mode	ASYNC-LATCHED
Number of digits	1.05E6 words
Number of digits	1M
Spare memory width	8
Memory IC type	FLASH 5V PROM
serial parallel	PARALLEL

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Am29F160D

Data Sheet

July 2003

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-

inally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appropriate,

and changes will be noted in a revision summary.

Continuity of Ordering Part Numbers

AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order

these products, please use only the Ordering Part Numbers listed in this document.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number

22288

Revision

Amendment

Issue Date

December 4, 2000

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . .

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . .

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . .

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Ordering Information . . . . . . . . . . . . . . . . . . . . . . .

Device Bus Operations . . . . . . . . . . . . . . . . . . . . .

Word/Byte Configuration ..........................................................

Requirements for Reading Array Data .....................................

Writing Commands/Command Sequences ..............................

Program and Erase Operation Status ......................................

Standby Mode ..........................................................................

Automatic Sleep Mode .............................................................

RESET#: Hardware Reset Pin .................................................

Output Disable Mode................................................................

Figure 5. Data# Polling Algorithm .................................................. 23

RY/BY#: Ready/Busy#............................................................

DQ6: Toggle Bit I ....................................................................

DQ2: Toggle Bit II ...................................................................

Reading Toggle Bits DQ6/DQ2...............................................

DQ5: Exceeded Timing Limits ................................................

DQ3: Sector Erase Timer .......................................................

Table 1. Am29F160D Device Bus Operations .................................. 8

Figure 6. Toggle Bit Algorithm........................................................ 25

Table 10. Write Operation Status................................................... 26

Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 27

Figure 7. Maximum Negative Overshoot Waveform ...................... 27

Figure 8. Maximum Positive Overshoot Waveform........................ 27

Table 2. Am29F160DT Sector Address Table (Top Boot) .............. 10

Table 3. Am29F160DB Sector Address Table (Bottom Boot)......... 11

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 27

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 28

TTL/NMOS Compatible .......................................................... 28

CMOS Compatible.................................................................. 29

Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Figure 9. Test Setup....................................................................... 30

Table 11. Test Specifications ......................................................... 30

Autoselect Mode..................................................................... 12

Table 4. Am29F160D Autoselect Codes (High Voltage Method).... 12

Sector Protection/Unprotection............................................... 12

Write Protect (WP#)................................................................ 13

Temporary Sector Unprotect .................................................. 13

Figure 1. Temporary Sector Unprotect Operation........................... 13

Key to Switching Waveforms. . . . . . . . . . . . . . . . 30

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 31

Figure 10. Read Operations Timings .............................................

Figure 11. RESET# Timings ..........................................................

Figure 12. BYTE# Timings for Read Operations............................

Figure 13. BYTE# Timings for Write Operations............................

Figure 14. Program Operation Timings..........................................

Figure 15. Chip/Sector Erase Operation Timings ..........................

Figure 16. Data# Polling Timings (During Embedded Algorithms).

Figure 17. Toggle Bit Timings (During Embedded Algorithms)......

Figure 18. DQ2 vs. DQ6.................................................................

Figure 19. Temporary Sector Unprotect Timing Diagram ..............

Figure 20. Sector Protect/Unprotect Timing Diagram ....................

Figure 21. Alternate CE# Controlled Write Operation Timings ......

Common Flash Memory Interface (CFI) . . . . . . . 15

Table 5. CFI Query Identification String .......................................... 15

Table 6. System Interface String..................................................... 16

Table 7. Device Geometry Definition .............................................. 16

Table 8. Primary Vendor-Specific Extended Query ........................ 17

Hardware Data Protection ...................................................... 18

Low V

Write Inhibit ...................................................................... 18

Write Pulse “Glitch” Protection ........................................................ 18

Logical Inhibit .................................................................................. 18

Power-Up Write Inhibit .................................................................... 18

Reading Array Data ................................................................

Reset Command.....................................................................

Autoselect Command Sequence ............................................

Word/Byte Program Command Sequence .............................

Unlock Bypass Command Sequence.............................................. 19

Figure 3. Program Operation .......................................................... 20

Chip Erase Command Sequence ........................................... 20

Sector Erase Command Sequence ........................................ 20

Erase Suspend/Erase Resume Commands........................... 21

Figure 4. Erase Operation............................................................... 21

Command Definitions ............................................................. 22

Table 9. Am29F160D Command Definitions................................... 22

DQ7: Data# Polling................................................................. 23

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 42

TSOP and SO Pin Capacitance . . . . . . . . . . . . . . 42

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 43

TSR048—48-Pin Reverse Thin Small Outline Package......... 44

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 45

Revision A (January 1999) ..................................................... 45

Revision B (June 14, 1999) .................................................... 45

Revision B+1 (July 7, 1999).................................................... 45

Revision B+2 (July 14, 1999).................................................. 45

Revision B+3 (July 30, 1999).................................................. 45

Revision B+4 (September 10, 1999) ...................................... 45

Revision C (November 16, 1999) ........................................... 45

Revision D (December 4, 2000) ............................................. 45

Am29F160D

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