EDI88130C70ZI datasheet, PDF - EEWORLD Datasheet

EDI88130C70ZI: DescriptionStandard SRAM, 128KX8, 70ns, CMOS, CZIP32, CERAMIC, ZIP-32; Categorystorage storage; File Size324KB，8 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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EDI88130C70ZI Overview

Standard SRAM, 128KX8, 70ns, CMOS, CZIP32, CERAMIC, ZIP-32

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Microsemi
package instruction	CERAMIC, ZIP-32
Reach Compliance Code	unknown
Maximum access time	70 ns
I/O type	COMMON
JESD-30 code	R-CZIP-T32
JESD-609 code	e0
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	ZIP
Encapsulate equivalent code	ZIP32,.1
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	12.7 mm
Maximum standby current	0.005 A
Minimum standby current	4.5 V
Maximum slew rate	0.095 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.27 mm
Terminal location	ZIG-ZAG
Maximum time at peak reflow temperature	NOT SPECIFIED

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