LH2310D datasheet, PDF - EEWORLD Datasheet

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LH2310D: DescriptionDUAL BUFFER AMPLIFIER, CDIP16; CategoryAnalog mixed-signal IC Amplifier circuit; File Size66KB，2 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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LH2310D Overview

DUAL BUFFER AMPLIFIER, CDIP16

LH2310D Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	DIP, DIP16,.3
Contacts	16
Reach Compliance Code	unknow
ECCN code	EAR99
Amplifier type	BUFFER
Maximum average bias current (IIB)	0.01 µA
Nominal bandwidth (3dB)	20 MHz
Maximum bias current (IIB) at 25C	0.007 µA
Maximum input offset voltage	10000 µV
JESD-30 code	R-CDIP-T16
JESD-609 code	e0
Negative supply voltage upper limit	-18 V
Nominal Negative Supply Voltage (Vsup)	-15 V
Number of functions	2
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	+-15 V
Certification status	Not Qualified
Maximum seat height	4.672 mm
Nominal slew rate	30 V/us
Maximum slew rate	11 mA
Supply voltage upper limit	18 V
Nominal supply voltage (Vsup)	15 V
surface mount	NO
technology	HYBRID
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

LH2310D Related Products

	LH2310D	LH2110	LH2110D	LH2210D
Description	DUAL BUFFER AMPLIFIER, CDIP16	DUAL BUFFER AMPLIFIER, CDIP16	DUAL BUFFER AMPLIFIER, CDIP16	DUAL BUFFER AMPLIFIER, CDIP16
Is it Rohs certified?	incompatible	-	incompatible	incompatible
Parts packaging code	DIP	-	DIP	DIP
package instruction	DIP, DIP16,.3	-	DIP, DIP16,.3	DIP, DIP16,.3
Contacts	16	-	16	16
Reach Compliance Code	unknow	-	unknow	unknow
ECCN code	EAR99	-	EAR99	EAR99
Amplifier type	BUFFER	-	BUFFER	BUFFER
Maximum average bias current (IIB)	0.01 µA	-	0.01 µA	0.01 µA
Nominal bandwidth (3dB)	20 MHz	-	20 MHz	20 MHz
Maximum bias current (IIB) at 25C	0.007 µA	-	0.003 µA	0.003 µA
Maximum input offset voltage	10000 µV	-	6000 µV	6000 µV
JESD-30 code	R-CDIP-T16	-	R-CDIP-T16	R-CDIP-T16
JESD-609 code	e0	-	e0	e0
Negative supply voltage upper limit	-18 V	-	-18 V	-18 V
Nominal Negative Supply Voltage (Vsup)	-15 V	-	-15 V	-15 V
Number of functions	2	-	2	2
Number of terminals	16	-	16	16
Maximum operating temperature	70 °C	-	125 °C	85 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	-	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	-	DIP	DIP
Encapsulate equivalent code	DIP16,.3	-	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	-	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
power supply	+-15 V	-	+-15 V	+-15 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	4.672 mm	-	4.672 mm	4.672 mm
Nominal slew rate	30 V/us	-	30 V/us	30 V/us
Maximum slew rate	11 mA	-	11 mA	11 mA
Supply voltage upper limit	18 V	-	18 V	18 V
Nominal supply voltage (Vsup)	15 V	-	15 V	15 V
surface mount	NO	-	NO	NO
technology	HYBRID	-	HYBRID	HYBRID
Temperature level	COMMERCIAL	-	MILITARY	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	-	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	-	2.54 mm	2.54 mm
Terminal location	DUAL	-	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	-	7.62 mm	7.62 mm

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