LMH6622 datasheet, PDF - EEWORLD Datasheet

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Datasheet> All Categories > semiconductor> Other integrated circuit (IC)> LMH6622

LMH6622: DescriptionVIDEO PREAMPLIFIER, PDSO8; Categorysemiconductor Other integrated circuit (IC); File Size535KB，18 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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LMH6622 Overview

VIDEO PREAMPLIFIER, PDSO8

LMH6622 Parametric

Parameter Name	Attribute value
Number of functions	2
Number of terminals	8
Processing package description	MSOP-8
state	Active
Consumer IC Type	VIDEO PREAMPLIFIER
jesd_30_code	S-PDSO-G8
jesd_609_code	e0
moisture_sensitivity_level	1
Packaging Materials	PLASTIC/EPOXY
ckage_code	TSSOP
packaging shape	SQUARE
Package Size	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
eak_reflow_temperature__cel_	260
qualification_status	COMMERCIAL
seated_height_max	1.09 mm
surface mount	YES
terminal coating	TIN LEAD
Terminal form	GULL WING
Terminal spacing	0.6500 mm
Terminal location	DUAL
ime_peak_reflow_temperature_max__s_	40
length	3 mm
width	3 mm

LMH6622 Related Products

	LMH6622	LMH6622MA	LMH6622MAX	LMH6622MM	LMH6622MMX
Description	VIDEO PREAMPLIFIER, PDSO8	VIDEO PREAMPLIFIER, PDSO8	VIDEO PREAMPLIFIER, PDSO8	VIDEO PREAMPLIFIER, PDSO8	1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8
Number of functions	2	2	2	2	2
Number of terminals	8	8	8	8	8
surface mount	YES	YES	YES	YES	YES
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
length	3 mm	4.9 mm	4.9 mm	3 mm	3 mm
width	3 mm	3.9 mm	3.9 mm	3 mm	3 mm
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible
Maker	-	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
package instruction	-	SOIC-8	SOIC-8	MSOP-8	MSOP-8
Reach Compliance Code	-	_compli	_compli	not_compliant	not_compliant
ECCN code	-	EAR99	EAR99	EAR99	EAR99
Amplifier type	-	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
JESD-30 code	-	R-PDSO-G8	R-PDSO-G8	S-PDSO-G8	S-PDSO-G8
JESD-609 code	-	e0	e0	e0	e0
Humidity sensitivity level	-	1	1	1	1
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	SOP	SOP	TSSOP	TSSOP
Package shape	-	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE
Package form	-	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	-	235	235	260	260
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	1.753 mm	1.753 mm	1.09 mm	1.09 mm
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal pitch	-	1.27 mm	1.27 mm	0.65 mm	0.65 mm
Maximum time at peak reflow temperature	-	30	30	40	40

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