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LMH6622MM

Description
VIDEO PREAMPLIFIER, PDSO8
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size535KB,18 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
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LMH6622MM Overview

VIDEO PREAMPLIFIER, PDSO8

LMH6622MM Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
package instructionMSOP-8
Reach Compliance Codenot_compliant
ECCN codeEAR99
Amplifier typeOPERATIONAL AMPLIFIER
JESD-30 codeS-PDSO-G8
JESD-609 codee0
length3 mm
Humidity sensitivity level1
Number of functions2
Number of terminals8
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeSQUARE
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.09 mm
surface mountYES
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3 mm

LMH6622MM Related Products

LMH6622MM LMH6622 LMH6622MA LMH6622MAX LMH6622MMX
Description VIDEO PREAMPLIFIER, PDSO8 VIDEO PREAMPLIFIER, PDSO8 VIDEO PREAMPLIFIER, PDSO8 VIDEO PREAMPLIFIER, PDSO8 1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8
length 3 mm 3 mm 4.9 mm 4.9 mm 3 mm
Number of functions 2 2 2 2 2
Number of terminals 8 8 8 8 8
surface mount YES YES YES YES YES
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal location DUAL DUAL DUAL DUAL DUAL
width 3 mm 3 mm 3.9 mm 3.9 mm 3 mm
Is it Rohs certified? incompatible - incompatible incompatible incompatible
Maker National Semiconductor(TI ) - National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI )
package instruction MSOP-8 - SOIC-8 SOIC-8 MSOP-8
Reach Compliance Code not_compliant - _compli _compli not_compliant
ECCN code EAR99 - EAR99 EAR99 EAR99
Amplifier type OPERATIONAL AMPLIFIER - OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
JESD-30 code S-PDSO-G8 - R-PDSO-G8 R-PDSO-G8 S-PDSO-G8
JESD-609 code e0 - e0 e0 e0
Humidity sensitivity level 1 - 1 1 1
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP - SOP SOP TSSOP
Package shape SQUARE - RECTANGULAR RECTANGULAR SQUARE
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 260 - 235 235 260
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum seat height 1.09 mm - 1.753 mm 1.753 mm 1.09 mm
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal pitch 0.65 mm - 1.27 mm 1.27 mm 0.65 mm
Maximum time at peak reflow temperature 40 - 30 30 40
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