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LMH6622MA

Description
VIDEO PREAMPLIFIER, PDSO8
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size535KB,18 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
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LMH6622MA Overview

VIDEO PREAMPLIFIER, PDSO8

LMH6622MA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
package instructionSOIC-8
Reach Compliance Code_compli
ECCN codeEAR99
Amplifier typeOPERATIONAL AMPLIFIER
JESD-30 codeR-PDSO-G8
JESD-609 codee0
length4.9 mm
Humidity sensitivity level1
Number of functions2
Number of terminals8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)235
Certification statusNot Qualified
Maximum seat height1.753 mm
surface mountYES
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width3.9 mm

LMH6622MA Related Products

LMH6622MA LMH6622 LMH6622MAX LMH6622MM LMH6622MMX
Description VIDEO PREAMPLIFIER, PDSO8 VIDEO PREAMPLIFIER, PDSO8 VIDEO PREAMPLIFIER, PDSO8 VIDEO PREAMPLIFIER, PDSO8 1 CHANNEL, VIDEO PREAMPLIFIER, PDSO8
length 4.9 mm 3 mm 4.9 mm 3 mm 3 mm
Number of functions 2 2 2 2 2
Number of terminals 8 8 8 8 8
surface mount YES YES YES YES YES
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal location DUAL DUAL DUAL DUAL DUAL
width 3.9 mm 3 mm 3.9 mm 3 mm 3 mm
Is it Rohs certified? incompatible - incompatible incompatible incompatible
Maker National Semiconductor(TI ) - National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI )
package instruction SOIC-8 - SOIC-8 MSOP-8 MSOP-8
Reach Compliance Code _compli - _compli not_compliant not_compliant
ECCN code EAR99 - EAR99 EAR99 EAR99
Amplifier type OPERATIONAL AMPLIFIER - OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
JESD-30 code R-PDSO-G8 - R-PDSO-G8 S-PDSO-G8 S-PDSO-G8
JESD-609 code e0 - e0 e0 e0
Humidity sensitivity level 1 - 1 1 1
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP - SOP TSSOP TSSOP
Package shape RECTANGULAR - RECTANGULAR SQUARE SQUARE
Package form SMALL OUTLINE - SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 235 - 235 260 260
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum seat height 1.753 mm - 1.753 mm 1.09 mm 1.09 mm
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal pitch 1.27 mm - 1.27 mm 0.65 mm 0.65 mm
Maximum time at peak reflow temperature 30 - 30 40 40
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