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LMX2350

Description
PLL FREQUENCY SYNTHESIZER, 1200 MHz, PDSO24
Categorysemiconductor    Analog mixed-signal IC   
File Size406KB,21 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric Compare

LMX2350 Overview

PLL FREQUENCY SYNTHESIZER, 1200 MHz, PDSO24

LMX2350 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals24
Minimum operating temperature-40 Cel
Maximum operating temperature85 Cel
Rated supply voltage3 V
Minimum supply/operating voltage2.7 V
Maximum supply/operating voltage5.5 V
Processing package descriptionPLASTIC, TSSOP-24
stateActive
Analog IC other typesPLL FREQUENCY SYNTHESIZER
jesd_30_codeR-PDSO-G24
jesd_609_codee0
moisture_sensitivity_level1
Packaging MaterialsPLASTIC/EPOXY
ckage_codeTSSOP
packaging shapeRECTANGULAR
Package SizeSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
eak_reflow_temperature__cel_260
qualification_statusCOMMERCIAL
seated_height_max1.1 mm
surface mountYES
CraftsmanshipBICMOS
Temperature levelINDUSTRIAL
terminal coatingTIN LEAD
Terminal formGULL WING
Terminal spacing0.6500 mm
Terminal locationDUAL
ime_peak_reflow_temperature_max__s_40
length7.8 mm
width4.4 mm
dditional_featurePROVIDES 8/9 OR 16/17 PRESCALE RATIOS

LMX2350 Related Products

LMX2350 LMX2350TM LMX2352TM
Description PLL FREQUENCY SYNTHESIZER, 1200 MHz, PDSO24 PLL FREQUENCY SYNTHESIZER, 1200 MHz, PDSO24 PLL FREQUENCY SYNTHESIZER, 1200 MHz, PDSO24
Number of functions 1 1 1
Number of terminals 24 24 24
Minimum operating temperature -40 Cel -40 Cel -40 Cel
Maximum operating temperature 85 Cel 85 Cel 85 Cel
Rated supply voltage 3 V 3 V 3 V
Minimum supply/operating voltage 2.7 V 2.7 V 2.7 V
Maximum supply/operating voltage 5.5 V 5.5 V 5.5 V
Processing package description PLASTIC, TSSOP-24 PLASTIC, TSSOP-24 PLASTIC, TSSOP-24
state Active Active Active
Analog IC other types PLL FREQUENCY SYNTHESIZER PLL FREQUENCY SYNTHESIZER PLL FREQUENCY SYNTHESIZER
jesd_30_code R-PDSO-G24 R-PDSO-G24 R-PDSO-G24
jesd_609_code e0 e0 e0
moisture_sensitivity_level 1 1 1
Packaging Materials PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
ckage_code TSSOP TSSOP TSSOP
packaging shape RECTANGULAR RECTANGULAR RECTANGULAR
Package Size SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
eak_reflow_temperature__cel_ 260 260 260
qualification_status COMMERCIAL COMMERCIAL COMMERCIAL
seated_height_max 1.1 mm 1.1 mm 1.1 mm
surface mount YES YES YES
Craftsmanship BICMOS BICMOS BICMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
terminal coating TIN LEAD TIN LEAD TIN LEAD
Terminal form GULL WING GULL WING GULL WING
Terminal spacing 0.6500 mm 0.6500 mm 0.6500 mm
Terminal location DUAL DUAL DUAL
ime_peak_reflow_temperature_max__s_ 40 40 40
length 7.8 mm 7.8 mm 7.8 mm
width 4.4 mm 4.4 mm 4.4 mm
dditional_feature PROVIDES 8/9 OR 16/17 PRESCALE RATIOS PROVIDES 8/9 OR 16/17 PRESCALE RATIOS PROVIDES 8/9 OR 16/17 PRESCALE RATIOS
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