LPC1313FHN33 datasheet, PDF - EEWORLD Datasheet

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LPC1313FHN33: Description32-BIT, FLASH, 72 MHz, MICROCONTROLLER, PQFP48; CategoryThe embedded processor and controller Microcontrollers and processors; File Size397KB，60 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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LPC1313FHN33 Overview

32-BIT, FLASH, 72 MHz, MICROCONTROLLER, PQFP48

LPC1313FHN33 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	QFN
package instruction	HVQCCN,
Contacts	33
Reach Compliance Code	compliant
Has ADC	YES
Address bus width
bit size	32
maximum clock frequency	25 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	S-PQCC-N33
length	7 mm
Humidity sensitivity level	3
Number of I/O lines	25
Number of terminals	33
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
ROM programmability	FLASH
Maximum seat height	1 mm
speed	72 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	2 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	7 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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LPC1311/13/42/43

32-bit ARM Cortex-M3 microcontroller; up to 32 kB flash and

8 kB SRAM; USB device

Rev. 02 — 6 May 2010

Product data sheet

1. General description

The LPC1311/13/42/43 are ARM Cortex-M3 based microcontrollers for embedded

applications featuring a high level of integration and low power consumption. The ARM

Cortex-M3 is a next generation core that offers system enhancements such as enhanced

debug features and a higher level of support block integration.

The LPC1311/13/42/43 operate at CPU frequencies of up to 72 MHz. The ARM

Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with

separate local instruction and data buses as well as a third bus for peripherals. The ARM

Cortex-M3 CPU also includes an internal prefetch unit that supports speculative

branching.

The peripheral complement of the LPC1311/13/42/43 includes up to 32 kB of flash

memory, up to 8 kB of data memory, USB Device (LPC1342/43 only), one Fast-mode Plus

C-bus interface, one UART, four general purpose timers, and up to 42 general purpose

I/O pins.

2. Features and benefits

ARM Cortex-M3 processor, running at frequencies of up to 72 MHz.

ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).

32 kB (LPC1343/13)/16 kB (LPC1342)/8 kB (LPC1311) on-chip flash programming

memory.

8 kB (LPC1343/13)/4 kB (LPC1342/11) SRAM.

In-System Programming (ISP) and In-Application Programming (IAP) via on-chip

bootloader software.

Selectable boot-up: UART or USB (USB on LPC134x only).

On LPC134x: USB MSC and HID on-chip drivers.

Serial interfaces:

USB 2.0 full-speed device controller with on-chip PHY for device (LPC1342/43

only).

UART with fractional baud rate generation, modem, internal FIFO, and

RS-485/EIA-485 support.

SSP controller with FIFO and multi-protocol capabilities.

C-bus interface supporting full I

C-bus specification and Fast-mode Plus with a

data rate of 1 Mbit/s with multiple address recognition and monitor mode.

LPC1313FHN33 Related Products

	LPC1313FHN33	LPC1311FHN33	LPC1311_10	LPC1343FBD48	PRA100C8-264RBPGT31
Description	32-BIT, FLASH, 72 MHz, MICROCONTROLLER, PQFP48	32-BIT, FLASH, 72 MHz, MICROCONTROLLER, PQFP48	32-BIT, FLASH, 72 MHz, MICROCONTROLLER, PQFP48	32-BIT, FLASH, 72 MHz, MICROCONTROLLER, PQFP48	Array/Network Resistor, Bussed, Thin Film, 0.1W, 264ohm, 50V, 0.1% +/-Tol, -10,10ppm/Cel, 3206,
Number of terminals	33	33	48	48	16
Maximum operating temperature	85 °C	85 °C	85 Cel	85 °C	155 °C
Minimum operating temperature	-40 °C	-40 °C	-40 Cel	-40 °C	-55 °C
Is it Rohs certified?	conform to	conform to	-	conform to	conform to
Maker	NXP	NXP	-	NXP	-
Parts packaging code	QFN	QFN	-	QFP	-
package instruction	HVQCCN,	HVQCCN,	-	7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT313-2, LQFP-48	SMT, 3206
Contacts	33	33	-	48	-
Reach Compliance Code	compliant	compliant	-	compli	compliant
Has ADC	YES	YES	-	YES	-
bit size	32	32	-	32	-
maximum clock frequency	25 MHz	25 MHz	-	25 MHz	-
DAC channel	NO	NO	-	NO	-
DMA channel	NO	NO	-	NO	-
JESD-30 code	S-PQCC-N33	S-PQCC-N33	-	S-PQFP-G48	-
length	7 mm	7 mm	-	7 mm	-
Humidity sensitivity level	3	3	-	1	-
Number of I/O lines	25	25	-	40	-
PWM channel	NO	NO	-	NO	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-
encapsulated code	HVQCCN	HVQCCN	-	LFQFP	-
Package shape	SQUARE	SQUARE	-	SQUARE	-
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	-	FLATPACK, LOW PROFILE, FINE PITCH	SMT
Peak Reflow Temperature (Celsius)	260	260	-	260	-
Certification status	Not Qualified	Not Qualified	-	Not Qualified	-
ROM programmability	FLASH	FLASH	-	FLASH	-
Maximum seat height	1 mm	1 mm	-	1.6 mm	-
speed	72 MHz	72 MHz	-	72 MHz	-
Maximum supply voltage	3.6 V	3.6 V	-	3.6 V	-
Minimum supply voltage	2 V	2 V	-	2 V	-
Nominal supply voltage	3.3 V	3.3 V	-	3.3 V	-
surface mount	YES	YES	Yes	YES	-
technology	CMOS	CMOS	-	CMOS	THIN FILM
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-
Terminal form	NO LEAD	NO LEAD	GULL WING	GULL WING	-
Terminal pitch	0.65 mm	0.65 mm	-	0.5 mm	-
Terminal location	QUAD	QUAD	Four	QUAD	-
Maximum time at peak reflow temperature	30	30	-	30	-
width	7 mm	7 mm	-	7 mm	-
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	-	MICROCONTROLLER	-
JESD-609 code	-	e4	-	e3	e4
Terminal surface	-	Nickel/Palladium/Gold (Ni/Pd/Au)	-	PURE TIN	Gold (Au) - with Nickel (Ni) barrier

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