General Information
DDR SDRAM
DDR SDRAM Product Guide
December 2007
Memory Division
December 2007
General Information
A. DDR SDRAM Component Ordering Information
1
2
3
4
5
6
7
8
9
10
11
DDR SDRAM
K 4 H X X X X X X X - X X X X
SAMSUNG Memory
DRAM
Product
Density & Refresh
Organization
Speed
Temperature & Power
Package Type
Revision
Interface (V
DD
, V
DDQ
)
Bank
1. SAMSUNG Memory : K
2. DRAM : 4
3. Product
H
:
DDR SDRAM
8. Revision
M
:
1st Gen.
A
:
2nd Gen.
B
:
3rd Gen.
C
:
4th Gen.
D
:
5th Gen.
E
:
6th Gen.
F
:
7th Gen.
G
:
8th Gen.
H
:
9th Gen.
J
:
11st Gen.
N
:
14th Gen.
4. Density & Refresh
28
:
128Mb, 4K/64ms
56
:
256Mb, 8K/64ms
51
:
512Mb, 8K/64ms
1G:
1Gb, 8K/64ms
2G:
2Gb, 8K/64ms
9. Package Type
T
:
TSOP II
N
:
sTSOP II
G
:
FBGA
L
H
F
6
:
:
:
:
U
:
TSOP II (Lead-free)
*1
V
:
sTSOP II (Lead-free)
*1
Z
:
FBGA (Lead-free)
*1
5. Organization
04
:
06
:
07
:
08
:
16
:
x4
x 4 Stack
x 8 Stack
x8
x16
TSOP II (Lead-free & Halogen-free)
*1
FBGA (Lead-free & Halogen-free)
*1
FBGA for 64Mb DDR (Lead-free & Halogen-free)
*1
sTSOP II (Lead-free & Halogen-free)
*1
Note 1: All of Lead-free or Halogen-free product are in
compliance with RoHS
10. Temperature & Power
C
:
Commercial Temp.( 0°C ~ 70°C) & Normal Power
L
:
Commercial Temp.( 0°C ~ 70°C) & Low Power
I
:
Industrial Temp.( -40°C ~ 85°C) & Normal Power
P
:
Industrial Temp.( -40°C ~ 85°C) & Low Power
6. Bank
3
:
4 Banks
7. Interface ( V
DD
, V
DDQ
)
8
:
SSTL-2 (2.5V, 2.5V)
11. Speed
CC
B3
A2
B0
:
:
:
:
DDR400
DDR333
DDR266
DDR266
(200MHz @ CL=3, tRCD=3, tRP=3)
(166MHz @ CL=2.5, tRCD=3, tRP=3)
*1
(133MHz @ CL=2 , tRCD=3, tRP=3)
(133MHz @ CL=2.5, tRCD=3, tRP=3)
Note 1: "B3" has compatibility with "A2" and "B0"
December 2007
General Information
B. DDR SDRAM Component Product Guide
Density
Bank
Part Number
Package
*1
& Power
*2
&
Speed
*3
LCCC/CB3
LLCC/LB3
FCCC/CB3
FLCC/LB3
UCA2/CB0
ULA2/LB0
ZCCC/CB3
ZLCC/LB3
UCCC/CB3
ULCC/LB3
ZCCC/CB3
ZLCC/LB3
UCCC/CB3
ULCC/LB3
ZCCC/CB3
ZLCC/LB3
LCB3/CB0
LLB3/LB0
LCCC/CB3
LLCC/LB3
LCCC/CB3
LLCC/LB3
UCB0
ULB0
ZCCC
ZLCC
UCCC/CB3
ULCC/LB3
ZCCC/CB3
ZLCC/LB3
UCCC/CB3
ULCC/LB3
ZCCC/CB3
ZLCC/LB3
Note 2 :
C
L
Commercial Temperature, Normal Power
Commercial Temperature, Low Power
CL = 2
CL = 2.5
CL = 3
DDR SDRAM
Org.
Interface Refresh
Power (V)
Package
66pinTSOPII
Avail.
Now
CS
64Mb N-die
4Banks K4H641638N
4M x 16
SSTL_2
4K/64m
2.5 ± 0.2V
60ball FBGA
66pinTSOPII
K4H560438H
64M x 4
60ball FBGA
60ball FBGA
32M x 8
SSTL_2
8K/64m
2.5 ±
0.2V
*4
60ball FBGA
66pinTSOPII
16M x 16
60ball FBGA
64M x 4
32M x 8
16M x 16
SSTL_2
8K/64m
2.5 ± 0.2V
*4
66pinTSOPII
66pinTSOPII
66pinTSOPII
66pinTSOPII
128M x 4
60ball FBGA
66pinTSOPII
64M x 8
SSTL_2
8K/64m
2.5 ±
0.2V
*4
60ball FBGA
66pinTSOPII
32M x 16
60ball FBGA
Now
CS
256Mb H-die
4Banks K4H560838H
Now
K4H561638H
K4H560438J
256Mb J-die
4Banks K4H560838J
K4H561638J
CS
CS
K4H510438D
512Mb D-die
4Banks K4H510838D
K4H511638D
Note 1 :
U
:
TSOP II (Lead-free)
V
:
sTSOP II (Lead-free)
Z
:
FBGA (Lead-free)
L
H
F
6
:
:
:
:
TSOP II (Lead-free & Halogen-free)
FBGA (Lead-free & Halogen-free)
FBGA for 64Mb DDR (Lead-free & Halogen-free)
sTSOP II (Lead-free & Halogen-free)
Note 3 :
133Mhz
DDR266(A2)
DDR266(B0)
-
166Mhz
-
DDR333(B3)
-
200Mhz
-
-
DDR400(CC)
- Commercial Temp. (0°C <Ta< 70°C)
- "B3" has compatibility with "A2" and "B0"
Note 4 :
DDR400
VDD/VDDQ
2.6V ± 0.1V
DDR333/266
2.5V ± 0.2V
December 2007
General Information
C. Industrial temp DDR SDRAM Component Product Guide
Density
Bank
Part Number
Package
*1
& Power
*2
& Speed
*3
Org.
Interface
Refresh
Power (V)
DDR SDRAM
Package
Avail.
256Mb H-die
4Banks K4H561638J
UICC/IB3/IB0
UPCC/PB3/PB0
ZIB3/IB0
ZPB3/PB0
LICC/IB3
LPCC/PB3
UIB3/IB0
UPB3/PB0
ZIB3/IB0
ZPB3/PB0
UIB3/IB0
UPB3/PB0
ZIB3/IB0
ZPB3/PB0
Note 2 :
I
P
66pinTSOPII
16M x 16
SSTL_2
8K/64m
2.5 ±
0.2V
*4
60ball FBGA
16M x 16
SSTL_2
8K/64m
2.5 ± 0.2V
*4
66pinTSOPII
66pinTSOPII
64M x 8
60ball FBGA
SSTL_2
32M x 16
60ball FBGA
8K/64m
2.5 ±
0.2V
*4
66pinTSOPII
Now
CS
Now
256Mb J-die
4Banks K4H561638J
K4H510838D
512Mb D-die
4Banks
K4H511638D
Note 1 :
U
:
TSOP II (Lead-free)
V
:
sTSOP II (Lead-free)
Z
:
FBGA (Lead-free)
L
H
F
6
:
:
:
:
TSOP II (Lead-free & Halogen-free)
FBGA (Lead-free & Halogen-free)
FBGA for 64Mb DDR (Lead-free & Halogen-free)
sTSOP II (Lead-free & Halogen-free)
Note 3 :
133Mhz
CL = 2
CL = 2.5
CL = 3
DDR266(A2)
DDR266(B0)
-
166Mhz
-
DDR333(B3)
-
200Mhz
-
-
DDR400(CC)
Industrial Temperature, Normal Power
Industrial Temperature, Low Power
- Industrial Temp. (-40°C <Ta< 85°C)
- "B3" has compatibility with "A2" and "B0"
Note 4 :
DDR400
VDD/VDDQ
2.6V ± 0.1V
DDR333/266
2.5V ± 0.2V
December 2007
General Information
D. DDR SDRAM Module Ordering Information
1
2
3
4
5
6
7
8
9
10
11
12
DDR SDRAM
M X X X L X X X X X X X - X X X
Memory Module
DIMM Configuration
Data bits
Feature
Depth
Refresh, # of Banks in Comp. & Interface
Speed
Power
PCB revision & Type
Package
Component Revision
Composition Component
1. Memory Module : M
7. Composition Component
0
3
4
8
9
:
:
:
:
:
x4
x8
x16
x 4 Stack
x 8 Stack
2. DIMM Configuration
3
:
DIMM
4
:
SODIMM
3. Data Bits
68 :
81 :
83 :
12 :
70 :
63 :
x64
x72
x72
x72
x64
x64
184pin Unbuffered DIMM
184pin ECC unbuffered DIMM
184pin Registered DIMM
184pin Low Profile Registered DIMM
200pin Unbuffered SODIMM
172pin Micro DIMM
8. Component Revision
A
:
2nd Gen.
M
:
1st Gen.
C
:
4th Gen.
B
:
3rd Gen.
E
:
6th Gen.
D
:
5th Gen.
G
:
8th Gen
F
:
7th Gen.
J
:
11th Gen.
H
:
9th Gen.
9. Package
U
:
TSOP II
*1
(Lead-Free)
T
:
TSOP II (400mil)
V
:
sTSOP II
*1
(Lead-Free)
N
:
sTSOP
Z
:
FBGA
*1
(Lead-Free)
G
:
FBGA
(Note 1 : All of Lead-free product are in compliance with RoHS)
10. PCB Revision & Type
4. Feature
L
:
DDR SDRAM (2.5V VDD)
5. Depth
16
:
16M
32
:
32M
64
:
64M
28
:
128M
56
:
256M
51
:
512M
17
33
65
29
57
:
16M (for 128Mb/512Mb)
:
32M (for 128Mb/512Mb)
:
64M (for 128Mb/512Mb)
:
128M (for 128Mb/512Mb)
:
256M (for 512Mb)
0
:
Mother PCB
1
:
1st Rev.
2
:
2nd Rev.
3
:
3rd Rev.
S
:
Reduced layer PCB
11. Temp & Power
C
:
Commercial Temp.( 0°C ~ 70°C) & Normal Power
L
:
Commercial Temp.( 0°C ~ 70°C) & Low Power
6. Refresh, # of Banks in comp. & Interface
1
:
2
:
4K/ 64ms Ref., 4Banks & SSTL-2
8K/ 64ms Ref., 4Banks & SSTL-2
12. Speed
CC
:
B3
:
A2
:
B0
:
DDR400
DDR333
DDR266
DDR266
(200MHz @ CL=3, tRCD=3, tRP=3)
(166MHz @ CL=2.5, tRCD=3, tRP=3)
(133MHz @ CL=2 , tRCD=3, tRP=3)
(133MHz @ CL=2.5, tRCD=3, tRP=3)
December 2007
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