Pressure
Freescale Semiconductor
Media Resistant Integrated Silicon
Pressure Sensor for Measuring
Absolute Pressure, On-Chip Signal
Conditioned, Temperature
Compensated and Calibrated
The MPXHZ6117A series pressure sensor integrates on-chip, bipolar op
amp circuitry and thin film resistor networks to provide a high output signal
and temperature compensation. The sensor’s packaging has been designed
to provide resistance to high humidity conditions as well as common
automotive media. The small form factor and high reliability of on-chip
integration make this sensor a logical and economical choice for the system
designer.
The MPXHZ6117A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output
signal that is proportional to applied pressure.
MPXHZ6117A
Rev 0, 03/2010
MPXHZ6117A
Series
10 to 115 kPa (14.5 to 16.7 psi)
0.4 to 4.653 V Output
Features
•
•
•
•
•
•
Resistant to High Humidity and Common Automotive Media
Improved Accuracy at High Temperature
1.5% Maximum Error over 0°C to 85°C
Temperature Compensated from -40°C to +125°C
Durable Thermoplastic (PPS) Surface Mount Package (SSOP) with Optional Axial Port
Ideally Suited for Microprocessor or Microcontroller Based Systems
ORDERING INFORMATION
# of Ports
Package
Case
Options
No.
None
Single
Dual
Super Small Outline Package (Media Resistant Gel) (MPXHZ6117A Series)
Device Name
MPXHZ6117A6U
MPXHZ6117A6T1
MPXHZ6117AC6U
MPXHZ6117AC6T1
Rail
Tape & Reel
Rail
Tape & Reel
1317
1317
1317A
1317A
Pressure Type
Gauge
Differential Absolute
Device Marking
•
•
•
•
•
•
•
•
MPXHZ6117A
MPXHZ6117A
MPXHZ6117A
MPXHZ6117A
SUPER SMALL OUTLINE PACKAGE
MPXHX6117A6U/6T1
CASE 1317
MPXHX6117AC6U/6T1
CASE 1317A
© Freescale Semiconductor, Inc., 2010. All rights reserved.
Pressure
Operating Characteristics
Table 1. Operating Characteristics
(V
S
= 5.0 V
DC
, T
A
= 25°C unless otherwise noted, Decoupling circuit shown in
Figure 3
required to meet electrical specifications.)
Characteristic
Pressure Range
Supply Voltage
(1)
Supply Current
Minimum Pressure
@ V
S
= 5.0 V
Full Scale Output
(2)
@ V
S
= 5.0 V
Full Scale Output
(3)
Sensitivity
Offset Stability
(4)
(0°C to 85°C)
(0°C to 85°C)
Symbol
P
OP
V
S
I
S
V
OFF
V
FSO
Min
10
4.75
—
0.340
Typ
—
5.0
6.0
0.4
Max
115
5.25
10
0.461
Units
kPa
Vdc
mAdc
Vdc
(0°C to 85°C)
4.592
4.653
4.714
Vdc
(0°C to 85°C)
V
FSS
V/P
—
—
—
-1.5
4.253
40.5
—
—
—
1.5
V
mV/kPa
%V
FSS
1. Device is ratiometric within this specified excitation range.
2. Offset (V
OFF
) is defined as the output voltage at the minimum rated pressure.
3. Full Scale Span (V
FSS
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum related pressure.
4. Accuracy (error budget) is the deviation in actual output from nominal output over the entire pressure range and temperature range as a
percent of V
SS
span at 25°C due to all sources of error including the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or
maximum rated pressure at 25°C.
Offset Stability: Output deviation, after 1000 temperature cycles, -40° to 125°C, and 1.5 million pressure cycles, with minimum rated pressure
applied.
TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
MPXHZ6117A
Preliminary
2
Sensors
Freescale Semiconductor
Pressure
Maximum Ratings
Table 2. Maximum Ratings
(1)
Rating
Maximum Pressure (P1 > P2)
Storage Temperature
Operating Temperature
Output Source Current @ Full Scale Output
(2)
Output Sink Current @ Minimum Pressure Offset
Symbol
P
MAX
T
STG
T
A
I
O
+
I
O
-
Value
400
-40 to +125
-40 to +125
+0.5
-0.5
Unit
kPa
°C
°C
mAdc
mAdc
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2. Maximum Output Current is controlled by effective impedance from V
OUT
to GND or V
OUT
to V
S
in the application circuit.
Figure 1
shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
V
S
2
Sensing
Element
Thin Film
Temperature
Compensation
and
Gain Stage #1
3
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
1
V
OUT
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for super small outline package devices.
Figure 1. Fully Integrated Pressure Sensor Schematic
MPXHZ6117A
Sensors
Freescale Semiconductor
Preliminary
3
Pressure
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration, and signal conditioning circuitry
onto a single monolithic chip.
Figure 2
illustrates the configuration in the basic chip
carrier (case 1317-04) prior to porting. A gel die coat isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm. The gel die coat and durable thermoplastic
package provide a media resistant barrier that allows the
sensor to operate reliably in high humidity conditions as well
as common automotive media. NOTE: The MPXHZ6117A
series pressure sensor’s operating characteristics, internal
reliability and qualification tests are based on use of air as the
pressure media. Media, other than air, may have adverse
effects on sensor performance and long–term reliability.
Contact the factory for information regarding media
compatibility in your application.
Figure 3
shows the recommended decoupling circuit for
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Figure 4
shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown (Figure
3).
The
output will saturate outside of the specified pressure range.
Fluorosilicone
Gel Die Coat
Wire Bond
Die
P1
Stainless Steel Cap
+5.1
V
Thermoplastic
Case
Lead
Frame
Absolute Element
Sealed Vacuum Reference
Die Bond
V
S
Pin 2
100 nF
MPXHZ6117A
V
OUT
Pin 4
GND Pin 3
47 pF
To ADC
51 K
Figure 2. Cross Sectional Diagram SSOP (not to scale)
Figure 3. Typical Application Circuit
(output source current operation)
5.0
4.5
3.5
Output (Volts)
3.0
2.5
2.0
1.5
1.0
0.5
Transfer Function:
V
out
= V
s
*[(0.0081*P-0.00095) ± 1.5*0.0081*V
S
*Tm]
4.0 V
S
= 5.0 V ± 0.25 Vdc, Temp. = 0 to 85°C
MAX
TYP
MIN
0
5
15
25
35
45
55 65 75
Pressure in kPa
85
95
105 115 125
Figure 4. Output vs. Absolute Pressure
MPXHZ6117A
Preliminary
4
Sensors
Freescale Semiconductor
Pressure
Temperature Error Band
MPXHZ6117A Series
4.0
3.0
Temperature
Error
Factor
2.0
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C.
Temp
-40
0 to 85
125
Break Points
Multiplier
3
1
1.75
Pressure Error Band
3.0
2.0
Pressure Error (kPa)
1.0
0.0
-1.0
-2.0
-3.0
Pressure
10 to 115 (kPa)
Error (Max)
±1.5 (kPa)
20
40
60
80
100
120
Pressure (in kPa)
Error Limits for Pressure
SURFACE MOUNTING INFORMATION
Minimum Recommended Footprint for Super Small Outline Packages
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.050
1.27
TYP
0.150
3.81
0.387
9.83
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 5. SSOP Footprint (Case 1317 and 1317A)
MPXHZ6117A
Sensors
Freescale Semiconductor
Preliminary
5
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