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Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]

To enable real-time monitoring of home security and automatically dial a number for voice prompts or send text messages when an alarm occurs, a GPRS-based embedded telephone alarm system was design...[Details]

Nios II is a configurable 16-/32-bit RISC processor. Combined with a rich set of peripheral-specific instructions and hardware acceleration units, it provides a highly flexible and powerful SOPC sy...[Details]

The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]

In recent years, with the application of the IEC61850 standard and the development and deployment of optoelectronic transformers, the concept of digital substations has been put into practical use ...[Details]

According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]

Robotics has become LiDAR 's "second growth curve." While LiDAR was still battling with its "pure vision" rivals in the automotive field, another field ignited the demand f...[Details]

Recently, AstroBo Robot, a subsidiary of Chenxing Automation, launched a new mobile collaborative palletizing product. Leveraging an omnidirectional mobile chassis, an intelligent scheduling system...[Details]

On August 20th, Tiantai Robotics Co., Ltd., along with strategic partners including Shandong Future Robotics Technology Co., Ltd., Shandong Future Data Technology Co., Ltd., and Gangzai Robotics Gr...[Details]

The all-new MG4 was recently officially announced on the Ministry of Industry and Information Technology's (MIIT) new vehicle announcement. The all-new MG4's semi-solid-state battery version addres...[Details]

Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]

Through AI connection technology supported by Qualcomm X85 5G modem and RF and Qualcomm FastConnect 7900 mobile connection system, seamless switching can be achieved between cellular net...[Details]

On August 21st, BYD announced the launch of its next-generation "Little White Pile" product, the "Lingchong" charging pile , which is now available for general sale. This charging pile feat...[Details]

Charging is an essential topic for electric vehicles. Batteries are a core component of new energy vehicles. So, what's the optimal charge level for electric vehicles? Based on current battery tech...[Details]

Puttshack's Trackaball uses the Nordic nRF54L15 system-on-chip (SoC) to monitor sensors and enable Bluetooth low energy connectivity, while the nPM2100 power management integrated circuit (PMIC) ...[Details]