5962-9559506HMC datasheet, PDF

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5962-9559506HMC: DescriptionSRAM Module, 128KX32, 45ns, CMOS, CQFP68,; Categorystorage storage; File Size214KB，36 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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5962-9559506HMC Overview

SRAM Module, 128KX32, 45ns, CMOS, CQFP68,

5962-9559506HMC Parametric

Parameter Name	Attribute value
Maker	Microsemi
package instruction	QFP, QFP68,1.1SQ,50
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	45 ns
I/O type	COMMON
JESD-30 code	S-XQFP-G68
memory density	4194304 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of terminals	68
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX32
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	QFP
Encapsulate equivalent code	QFP68,1.1SQ,50
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum standby current	0.0116 A
Minimum standby current	2 V
Maximum slew rate	0.6 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	QUAD

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REVISIONS

LTR

DESCRIPTION

Added device type 11. Added vendor CAGE code 0EU86 for device

types 05 through 09. -sld

Add note to paragraph 1.2.2 and table I, conditions. Add case

outline 9.

Correct figure 1, case outline M diagram, adding dimension "c", lead

thickness. Change figure 1, case outline M, A2 maximum dimension

from 0.015" to 0.025" and clarify A2 dimension in note 3.

Figure 1, case outline 9; changed the min limit for dimensions D2/E2

from 0.990 inches to 0.980 inches. Added vendor cage 88379 for the

case outline 9. Updated paragraph 1.2.3 to describe the five class

levels. -sld

Added device types 12 through 18. -sld

Added case outline A -sld

Added case outline B. Added note to paragraph 1.2.4. -sld.

Re-inserted case outline 9 drawing to figure 1. -sld.

DATE (YR-MO-DA)

99-09-07

00-04-06

00-06-14

APPROVED

Raymond Monnin

01-05-06

Raymond Monnin

01-11-14

03-02-21

03-09-22

04-01-07

Raymond Monnin

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Steve L. Duncan

CHECKED BY

Michael C. Jones

STANDARD

MICROCIRCUIT

DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216

http://www.dscc.dla.mil

THIS DRAWING IS

AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

APPROVED BY

Kendall A. Cottongim

MICROCIRCUIT, HYBRID, MEMORY,

DIGITAL, STATIC RANDOM ACCESS

MEMORY, CMOS, 128K x 32-BIT

DRAWING APPROVAL DATE

95-07-19

REVISION LEVEL

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-95595

DSCC FORM 2233

APR 97

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

5962-E101-04

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a

part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in

the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the

solicitation.

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.

STANDARDS

DEPARTMENT OF DEFENSE

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing shall take precedence. Nothing in this document , however, supercedes applicable laws and regulations unless

a specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in

accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as

designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class.

Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534).

Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not

perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device

class.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38534 and herein.

3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.

3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4 and 5.

3.2.5 Block diagram(s). The block diagram(s) shall be as specified on figure 6.

3.2.6 Output load circuit. The output load circuit shall be as specified on figure 7.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

SIZE

REVISION LEVEL

5962-95595

SHEET

DSCC FORM 2234

APR 97

5962-9559506HMC Related Products

	5962-9559506HMC	5962-9559506HXC	5962-9559507HXC	5962-9559505HMC
Description	SRAM Module, 128KX32, 45ns, CMOS, CQFP68,	SRAM Module, 128KX32, 45ns, CMOS, CQFP68,	SRAM Module, 128KX32, 35ns, CMOS, CQFP68,	SRAM Module, 128KX32, 55ns, CMOS, CQFP68,
package instruction	QFP, QFP68,1.1SQ,50	QFF, QFL68,1.56SQ	QFF, QFL68,1.56SQ	QFP, QFP68,1.1SQ,50
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	45 ns	45 ns	35 ns	55 ns
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-XQFP-G68	S-XQFP-F68	S-XQFP-F68	S-XQFP-G68
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	32	32	32	32
Number of terminals	68	68	68	68
word count	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
organize	128KX32	128KX32	128KX32	128KX32
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	QFP	QFF	QFF	QFP
Encapsulate equivalent code	QFP68,1.1SQ,50	QFL68,1.56SQ	QFL68,1.56SQ	QFP68,1.1SQ,50
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	FLATPACK	FLATPACK	FLATPACK
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum standby current	0.0116 A	0.0116 A	0.0116 A	0.0116 A
Minimum standby current	2 V	2 V	2 V	2 V
Maximum slew rate	0.6 mA	0.6 mA	0.6 mA	0.6 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	GULL WING	FLAT	FLAT	GULL WING
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD

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