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LY62L204916AGL-55SLT

Description
2048K X 16 BIT LOW POWER CMOS SRAM
Categorystorage    storage   
File Size363KB,12 Pages
ManufacturerLyontek
Websitehttp://www.lyontek.com.tw/index.html
Environmental Compliance
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LY62L204916AGL-55SLT Overview

2048K X 16 BIT LOW POWER CMOS SRAM

LY62L204916AGL-55SLT Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerLyontek
package instructionTFBGA-48
Reach Compliance Codecompliant
Maximum access time55 ns
JESD-30 codeR-PBGA-B48
length10 mm
memory density33554432 bit
Memory IC TypeSTANDARD SRAM
memory width16
Number of functions1
Number of terminals48
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX16
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum seat height1.4 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm
Base Number Matches1
®
LY62L204916A
Rev.1.2
2048K X 16 BIT LOW POWER CMOS SRAM
REVISION HISTORY
Revision
Rev. 1.0
Rev. 1.1
Rev. 1.2
Description
Initial Issue
Typo error on page 9, revised as 8mmx10mm.
1. Revise I
SB1
on page 4
&
I
DR
on page 8
2. Revise VIH(max) & VIL(min) note on page 4
VIH(max) = VCC + 2.0V for pulse width less than 6ns.
VIL(min) = VSS - 2.0V for pulse width less than 6ns.
Issue Date
Nov. 06. 2012
Dec.18. 2012
June. 10. 2013
Lyontek Inc.
reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
0

LY62L204916AGL-55SLT Related Products

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Description 2048K X 16 BIT LOW POWER CMOS SRAM 2048K X 16 BIT LOW POWER CMOS SRAM 2048K X 16 BIT LOW POWER CMOS SRAM 2048K X 16 BIT LOW POWER CMOS SRAM 2048K X 16 BIT LOW POWER CMOS SRAM 2048K X 16 BIT LOW POWER CMOS SRAM 2048K X 16 BIT LOW POWER CMOS SRAM 2048K X 16 BIT LOW POWER CMOS SRAM
Is it Rohs certified? conform to conform to conform to conform to conform to conform to - conform to
Maker Lyontek Lyontek Lyontek Lyontek Lyontek Lyontek - Lyontek
package instruction TFBGA-48 LFBGA, TFBGA-48 TFBGA-48 LFBGA, TFBGA-48 - TFBGA-48
Reach Compliance Code compliant compliant compliant compliant compliant compliant - compliant
Maximum access time 55 ns 55 ns 70 ns 70 ns 70 ns 55 ns - 70 ns
JESD-30 code R-PBGA-B48 R-PBGA-B48 R-PBGA-B48 R-PBGA-B48 R-PBGA-B48 R-PBGA-B48 - R-PBGA-B48
length 10 mm 10 mm 10 mm 10 mm 10 mm 10 mm - 10 mm
memory density 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit - 33554432 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM - STANDARD SRAM
memory width 16 16 16 16 16 16 - 16
Number of functions 1 1 1 1 1 1 - 1
Number of terminals 48 48 48 48 48 48 - 48
word count 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words - 2097152 words
character code 2000000 2000000 2000000 2000000 2000000 2000000 - 2000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 85 °C 85 °C 70 °C 85 °C - 70 °C
organize 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16 - 2MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code LFBGA LFBGA LFBGA LFBGA LFBGA LFBGA - LFBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
Package form GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH - GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL - PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
Maximum seat height 1.4 mm 1.4 mm 1.4 mm 1.4 mm 1.4 mm 1.4 mm - 1.4 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V - 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V - 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V - 3 V
surface mount YES YES YES YES YES YES - YES
technology CMOS CMOS CMOS CMOS CMOS CMOS - CMOS
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL - COMMERCIAL
Terminal form BALL BALL BALL BALL BALL BALL - BALL
Terminal pitch 0.75 mm 0.75 mm 0.75 mm 0.75 mm 0.75 mm 0.75 mm - 0.75 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM - BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
width 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm - 8 mm
Base Number Matches 1 1 1 1 1 1 - 1
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