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5962-9471603HBX

Description
Flash Module, 128KX32, 90ns, CQFP68, CERAMIC, QFP-68
Categorystorage    storage   
File Size5MB,923 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

5962-9471603HBX Overview

Flash Module, 128KX32, 90ns, CQFP68, CERAMIC, QFP-68

5962-9471603HBX Parametric

Parameter NameAttribute value
package instructionCERAMIC, QFP-68
Reach Compliance Codeunknown
Maximum access time90 ns
JESD-30 codeS-CQFP-G68
length23.875 mm
memory density4194304 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals68
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height4.06 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
width23.875 mm
NOT MEASUREMENT
SENSITIVE
MIL-HDBK-103AJ
19 SEPTEMBER 2011
SUPERSEDING
MIL-HDBK-103AH
28 MARCH 2011
DEPARTMENT OF DEFENSE
HANDBOOK
LIST OF STANDARD MICROCIRCUIT DRAWINGS
This handbook is for guidance only. Do not cite this document
as a requirement.
AMSC N/A
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