K6R4008C1C-JI20 datasheet, PDF

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K6R4008C1C-JI20: DescriptionStandard SRAM, 512KX8, 20ns, CMOS, PDSO36, 0.400 INCH, PLASTIC, SOJ-36; Categorystorage storage; File Size184KB，9 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K6R4008C1C-JI20 Overview

Standard SRAM, 512KX8, 20ns, CMOS, PDSO36, 0.400 INCH, PLASTIC, SOJ-36

K6R4008C1C-JI20 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	SOJ
package instruction	SOJ, SOJ36,.44
Contacts	36
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	20 ns
I/O type	COMMON
JESD-30 code	R-PDSO-J36
JESD-609 code	e0
length	23.5 mm
memory density	4194304 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	36
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SOJ
Encapsulate equivalent code	SOJ36,.44
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	3.76 mm
Maximum standby current	0.01 A
Minimum standby current	4.5 V
Maximum slew rate	0.155 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.16 mm

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PRELIMINARY

K6R4008C1C-C, K6R4008C1C-E, K6R4008C1C-I CMOS SRAM

Document Title

512Kx8 Bit High Speed Static RAM(5V Operating).

Operated at Extended and Industrial Temperature Ranges.

Revision History

RevNo.

Rev. 0.0

Rev. 1.0

History

Initial release with Preliminary.

1.1 Removed Low power Version.

1.2 Removed Data Retention Characteristics.

1.3 Changed I

SB1

to 20mA

2.1 Relax D.C parameters.

Item

12ns

15ns

20ns

170mA

165mA

160mA

Current

195mA

190mA

185mA

Draft Data

Feb. 12. 1999

Mar. 29. 1999

Remark

Preliminary

Rev. 2.0

Aug. 19. 1999

Preliminary

2.2 Relax Absolute Maximum Rating.

Item

Voltage on Any Pin Relative to Vss

Rev. 3.0

3.1 Delete Preliminary

3.2 Update D.C parameters and 10ns part.

195mA

190mA

185mA

70mA

sb1

20mA

170mA

160mA

150mA

140mA

Current

60mA

sb1

10mA

-0.5 to 7.0

Current

-0.5 to Vcc+0.5

Mar. 27. 2000

Final

10ns

12ns

15ns

20ns

3.3 Added Extended temperature range

The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the

specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-

tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.

-1-

Rev 3.0

March 2000

K6R4008C1C-JI20 Related Products

	K6R4008C1C-JI20	K6R4008C1C-JE20	K6R4008C1C-TE20	K6R4008C1C-JC20	K6R4008C1C-TC20	K6R4008C1C-TI20
Description	Standard SRAM, 512KX8, 20ns, CMOS, PDSO36, 0.400 INCH, PLASTIC, SOJ-36	Standard SRAM, 512KX8, 20ns, CMOS, PDSO36, 0.400 INCH, PLASTIC, SOJ-36	Standard SRAM, 512KX8, 20ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44	Standard SRAM, 512KX8, 20ns, CMOS, PDSO36, 0.400 INCH, PLASTIC, SOJ-36	Standard SRAM, 512KX8, 20ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44	Standard SRAM, 512KX8, 20ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	SOJ	SOJ	TSOP2	SOJ	TSOP2	TSOP2
package instruction	SOJ, SOJ36,.44	SOJ, SOJ36,.44	TSOP2, TSOP44,.46,32	SOJ, SOJ36,.44	TSOP2, TSOP44,.46,32	TSOP2, TSOP44,.46,32
Contacts	36	36	44	36	44	44
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	20 ns	20 ns	20 ns	20 ns	20 ns	20 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDSO-J36	R-PDSO-J36	R-PDSO-G44	R-PDSO-J36	R-PDSO-G44	R-PDSO-G44
JESD-609 code	e0	e0	e0	e0	e0	e0
length	23.5 mm	23.5 mm	18.41 mm	23.5 mm	18.41 mm	18.41 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of terminals	36	36	44	36	44	44
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	70 °C	70 °C	85 °C
Minimum operating temperature	-40 °C	-25 °C	-25 °C	-	-	-40 °C
organize	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOJ	SOJ	TSOP2	SOJ	TSOP2	TSOP2
Encapsulate equivalent code	SOJ36,.44	SOJ36,.44	TSOP44,.46,32	SOJ36,.44	TSOP44,.46,32	TSOP44,.46,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.76 mm	3.76 mm	1.2 mm	3.76 mm	1.2 mm	1.2 mm
Maximum standby current	0.01 A	0.01 A	0.01 A	0.01 A	0.01 A	0.01 A
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	0.155 mA	0.155 mA	0.155 mA	0.14 mA	0.14 mA	0.155 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	OTHER	OTHER	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	J BEND	GULL WING	J BEND	GULL WING	GULL WING
Terminal pitch	1.27 mm	1.27 mm	0.8 mm	1.27 mm	0.8 mm	0.8 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm
Maker	-	-	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG

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