Solder Profile and Pattern
1) Dip Types (LA, LB ,LAP,LBP series)
Please keep the preheat and peak temperatures with dip units as low as possible and the times as short as
is feasible, since the products are susceptible to heat during flow soldering. As a guide, ensure that the
internal temperature of the LED numeric display does not exceed 100°C.
Soldering Example
300
3s or less
Temperature
°C
250
200
150
100
50
0
Preheat 30s
or less
Conditions
General
flow conditions
A single wave is better than a double wave, while
stationary flow method is the best.
Solder Pattern Example
LA-301 series
φ1.5
+0.1
0
land shape
260°C or less
After soldering, immediately lower
the temperature of the substrate
φ0.8
+0.1
0
hole shape
Other series
φ2.0
+0.1
0
land shape
0
20
40
60
80
Time (s)
100
120
140
φ1.0
+0.1
0
hole shape
Item
Solder dip
Conditions
At least 2mm from the base of the lead pin.
Solder Temperature
Preheat temperature must
be no greater than 80°C.
Process Duration
30 seconds or less
3 seconds or less
3 seconds or less
No more than 260°C.
Solder iron
Reflow
At least 2mm from the base of the lead pin.
Power: No more than 30W.
No more than 300°C.
Reflow cannot be used. (other than the LF-301 series)
∗
Please use a resin-based flux, since flux that is acidic or highly alkaline could cause corrosion.
2) Surface Mount Type (LF-301 series)
Please refer to the following reflow soldering profile and pattern examples for surface mount units.
Reflow Soldering Example
Substrate Surface Temperature (°C)
D: Peak Temperature
Solder Pattern Example
LF-301 A/K series
1.8
250
200
150
100
C: Heat Slope 2
B: Preheat
A: Heat Slope 1
50
1.8
0
0
50
100
150
Time (s)
C (Heat Slope 2)
4°C/s max.
200
250
300
(10.4)
E: 200°C
+ range
14
10-0.6
D (Peak temperature, peak time)
250°C max, 5s max.
E (200°C + range)
50s max.
P=1.27
Type
LF-301A/K series
A (Heat Slope 1)
4°C/s max
B (Preheat)
140 to 160°C
(1 min. or less)
Analogue and Mixed Signal
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