2225HC681KAT9A datasheet, PDF - EEWORLD Datasheet

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2225HC681KAT9A: DescriptionCeramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.00068uF, Surface Mount, 2225, CHIP, ROHS COMPLIANT; CategoryPassive components capacitor; File Size2MB，95 Pages; ManufacturerAVX; Environmental Compliance

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2225HC681KAT9A Overview

Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.00068uF, Surface Mount, 2225, CHIP, ROHS COMPLIANT

2225HC681KAT9A Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
package instruction	, 2225
Reach Compliance Code	compliant
ECCN code	EAR99
capacitance	0.00068 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	2.54 mm
JESD-609 code	e3
length	5.72 mm
Manufacturer's serial number	2225
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	10%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	BULK
positive tolerance	10%
Rated (DC) voltage (URdc)	3000 V
series	SIZE(HIGH VOLTAGE)
size code	2225
surface mount	YES
Temperature characteristic code	X7R
Temperature Coefficient	15% ppm/°C
Terminal surface	Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
width	6.35 mm

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A KYOCERA GROUP COMPANY

AVX

SMPS Caps/High Voltage Caps

Tip & Ring/Cap Arrays/Discoidals

Advanced Applications

Contents

Introduction – Application Specific MLCs

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3

SMPS Capacitors

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7

SM Style Stacked MLC Capacitors (US Preferred Sizes) . . . . . . . . . . . . . . . . . . . . . . . . . 8-28

CH/CV Style (European Preferred Sizes) Vertical/Horizontal Mount . . . . . . . . . . . . . . . . 29-34

RH Style (European Preferred Sizes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35-36

Assembly Guidelines (SM, CH, CV & RH Styles) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37-38

SK Style . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39-40

SE Style . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41-42

CECC Offering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

High Voltage MLC Leaded

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

ESA Qualified SMPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44-49

HV Style (US Preferred Sizes) DIP Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50-52

CH/CV Style (European Preferred Sizes)

Vertical/Horizontal Mount, DIP & Radial Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53-56

SV Style Radial Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57-59

MLC Chip Capacitors

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

Basic Construction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61-64

Surface Mounting Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65-68

High Voltage MLC Chips . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69-70

Hi-Q

High RF Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71-75

Tip & Ring Chips. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76-77

MLC Chips, Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

Single-In-Line Packages (SIP)

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79-80

Discoidal MLC Feed-Through Capacitors and Filters

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

DC Style (US Preferred Sizes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82-84

XB Style (European Preferred Sizes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85-88

XF Style (Feed-Through Discoidal). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85-88

Filtered Arrays XD Type

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

CECC Ceramic Chips

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

Baseline Management – BS9100 Requirements

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91

Advanced Application Specific Products

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

AVX Internet/FAX/CD Rom/Software

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

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