Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
ESD0P2RF-02LRH E6327
MA000617966
PG-TSLP-2-17
Material Group
non noble metal
noble metal
inorganic material
non noble metal
noble metal
inorganic material
organic material
plastics
inorganic material
noble metal
noble metal
< 10%
Substances
tin
gold
silicon
nickel
gold
antimonytrioxide
carbon black
epoxy resin
silicondioxide
gold
silver
CAS#
if applicable
7440-31-5
7440-57-5
7440-21-3
7440-02-0
7440-57-5
1309-64-4
1333-86-4
-
60676-86-0
7440-57-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.000
0.001
0.010
0.138
0.006
0.000
0.004
0.057
0.359
0.010
0.016
Average
Mass
[%]
0.06
0.22
1.67
22.95
1.03
0.03
0.70
9.43
59.69
1.60
2.62
30. January 2015
0.60 mg
Sum
[%]
Average
Mass
[ppm]
580
2247
1.95
22.95
1.03
16654
229524
10251
349
6985
94303
69.85
1.60
2.62
596901
16030
26176
698538
16030
26176
1000000
19481
229524
10251
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com