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AM27S30DCT

Description
OTP ROM, 512X8, 55ns, TTL, CDIP24,
Categorystorage    storage   
File Size235KB,5 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric Compare View All

AM27S30DCT Overview

OTP ROM, 512X8, 55ns, TTL, CDIP24,

AM27S30DCT Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP24,.6
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time55 ns
JESD-30 codeR-XDIP-T24
JESD-609 codee0
memory density4096 bit
Memory IC TypeOTP ROM
memory width8
Number of terminals24
word count512 words
character code512
Maximum operating temperature70 °C
Minimum operating temperature
organize512X8
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Maximum slew rate0.175 mA
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

AM27S30DCT Related Products

AM27S30DCT AM27S31ADMB AM27S31LMB AM27S31DM AM27S31AFMB AM27S31PCTB
Description OTP ROM, 512X8, 55ns, TTL, CDIP24, OTP ROM, 512X8, 45ns, TTL, CDIP24 OTP ROM, 512X8, 70ns, TTL, CQCC32 OTP ROM, 512X8, 70ns, TTL, CDIP24 OTP ROM, 512X8, 45ns, TTL, CDFP24 OTP ROM, 512X8, 55ns, TTL, PDIP24
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP24,.6 DIP, DIP24,.6 QCCN, LCC32,.45X.55 DIP, DIP24,.6 DFP, FL24,.4 DIP, DIP24,.6
Reach Compliance Code unknown compli compliant unknown compliant unknown
Maximum access time 55 ns 45 ns 70 ns 70 ns 45 ns 55 ns
JESD-30 code R-XDIP-T24 R-XDIP-T24 R-XQCC-N32 R-XDIP-T24 R-XDFP-F24 R-PDIP-T24
JESD-609 code e0 e0 e0 e0 e0 e0
memory density 4096 bit 4096 bi 4096 bit 4096 bit 4096 bit 4096 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8 8 8
Number of terminals 24 24 32 24 24 24
word count 512 words 512 words 512 words 512 words 512 words 512 words
character code 512 512 512 512 512 512
Maximum operating temperature 70 °C 125 °C 125 °C 125 °C 125 °C 70 °C
Minimum operating temperature - -55 °C -55 °C -55 °C -55 °C -
organize 512X8 512X8 512X8 512X8 512X8 512X8
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY
encapsulated code DIP DIP QCCN DIP DFP DIP
Encapsulate equivalent code DIP24,.6 DIP24,.6 LCC32,.45X.55 DIP24,.6 FL24,.4 DIP24,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE CHIP CARRIER IN-LINE FLATPACK IN-LINE
Maximum slew rate 0.175 mA 0.175 mA 0.175 mA 0.175 mA 0.175 mA 0.175 mA
surface mount NO NO YES NO YES NO
technology TTL TTL TTL TTL TTL TTL
Temperature level COMMERCIAL MILITARY MILITARY MILITARY MILITARY COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE FLAT THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL QUAD DUAL DUAL DUAL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
power supply - 5 V 5 V 5 V 5 V 5 V
Filter level - MIL-STD-883 Class B (Modified) MIL-STD-883 Class B (Modified) MIL-STD-883 Class C MIL-STD-883 Class B (Modified) -
Nominal supply voltage (Vsup) - 5 V 5 V 5 V 5 V 5 V
Base Number Matches - 1 1 1 1 -
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