OTP ROM, 512X8, 55ns, TTL, PDIP24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| package instruction | DIP, DIP24,.6 |
| Reach Compliance Code | unknown |
| Maximum access time | 55 ns |
| JESD-30 code | R-PDIP-T24 |
| JESD-609 code | e0 |
| memory density | 4096 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of terminals | 24 |
| word count | 512 words |
| character code | 512 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512X8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Maximum slew rate | 0.175 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| AM27S31PCTB | AM27S31ADMB | AM27S31LMB | AM27S31DM | AM27S31AFMB | AM27S30DCT | |
|---|---|---|---|---|---|---|
| Description | OTP ROM, 512X8, 55ns, TTL, PDIP24 | OTP ROM, 512X8, 45ns, TTL, CDIP24 | OTP ROM, 512X8, 70ns, TTL, CQCC32 | OTP ROM, 512X8, 70ns, TTL, CDIP24 | OTP ROM, 512X8, 45ns, TTL, CDFP24 | OTP ROM, 512X8, 55ns, TTL, CDIP24, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP24,.6 | DIP, DIP24,.6 | QCCN, LCC32,.45X.55 | DIP, DIP24,.6 | DFP, FL24,.4 | DIP, DIP24,.6 |
| Reach Compliance Code | unknown | compli | compliant | unknown | compliant | unknown |
| Maximum access time | 55 ns | 45 ns | 70 ns | 70 ns | 45 ns | 55 ns |
| JESD-30 code | R-PDIP-T24 | R-XDIP-T24 | R-XQCC-N32 | R-XDIP-T24 | R-XDFP-F24 | R-XDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 4096 bit | 4096 bi | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 24 | 24 | 32 | 24 | 24 | 24 |
| word count | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
| character code | 512 | 512 | 512 | 512 | 512 | 512 |
| Maximum operating temperature | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C |
| Minimum operating temperature | - | -55 °C | -55 °C | -55 °C | -55 °C | - |
| organize | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | QCCN | DIP | DFP | DIP |
| Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | LCC32,.45X.55 | DIP24,.6 | FL24,.4 | DIP24,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | FLATPACK | IN-LINE |
| Maximum slew rate | 0.175 mA | 0.175 mA | 0.175 mA | 0.175 mA | 0.175 mA | 0.175 mA |
| surface mount | NO | NO | YES | NO | YES | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | - | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class C | MIL-STD-883 Class B (Modified) | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - |