AM27S31AFMB datasheet, PDF - EEWORLD Datasheet

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AM27S31AFMB: DescriptionOTP ROM, 512X8, 45ns, TTL, CDFP24; Categorystorage storage; File Size235KB，5 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM27S31AFMB Overview

OTP ROM, 512X8, 45ns, TTL, CDFP24

AM27S31AFMB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DFP, FL24,.4
Reach Compliance Code	compliant
Maximum access time	45 ns
JESD-30 code	R-XDFP-F24
JESD-609 code	e0
memory density	4096 bit
Memory IC Type	OTP ROM
memory width	8
Number of terminals	24
word count	512 words
character code	512
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512X8
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL24,.4
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
Maximum slew rate	0.175 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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AM27S31AFMB Related Products

	AM27S31AFMB	AM27S31ADMB	AM27S31LMB	AM27S31DM	AM27S31PCTB	AM27S30DCT
Description	OTP ROM, 512X8, 45ns, TTL, CDFP24	OTP ROM, 512X8, 45ns, TTL, CDIP24	OTP ROM, 512X8, 70ns, TTL, CQCC32	OTP ROM, 512X8, 70ns, TTL, CDIP24	OTP ROM, 512X8, 55ns, TTL, PDIP24	OTP ROM, 512X8, 55ns, TTL, CDIP24,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DFP, FL24,.4	DIP, DIP24,.6	QCCN, LCC32,.45X.55	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6
Reach Compliance Code	compliant	compli	compliant	unknown	unknown	unknown
Maximum access time	45 ns	45 ns	70 ns	70 ns	55 ns	55 ns
JESD-30 code	R-XDFP-F24	R-XDIP-T24	R-XQCC-N32	R-XDIP-T24	R-PDIP-T24	R-XDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0
memory density	4096 bit	4096 bi	4096 bit	4096 bit	4096 bit	4096 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8
Number of terminals	24	24	32	24	24	24
word count	512 words	512 words	512 words	512 words	512 words	512 words
character code	512	512	512	512	512	512
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	70 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-	-
organize	512X8	512X8	512X8	512X8	512X8	512X8
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC
encapsulated code	DFP	DIP	QCCN	DIP	DIP	DIP
Encapsulate equivalent code	FL24,.4	DIP24,.6	LCC32,.45X.55	DIP24,.6	DIP24,.6	DIP24,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE
Maximum slew rate	0.175 mA	0.175 mA	0.175 mA	0.175 mA	0.175 mA	0.175 mA
surface mount	YES	NO	YES	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL
power supply	5 V	5 V	5 V	5 V	5 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class C	-	-
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	-
Base Number Matches	1	1	1	1	-	-

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