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EGF30DH

Description
SURFACE MOUNT GLASS PASSIVATED JUNCTION HIGH EFFICIENT RECTIFIER
CategoryDiscrete semiconductor    diode   
File Size56KB,2 Pages
ManufacturerZOWIE Technology Corporation
Websitehttp://www.zowie.com.tw/
Download Datasheet Parametric Compare View All

EGF30DH Overview

SURFACE MOUNT GLASS PASSIVATED JUNCTION HIGH EFFICIENT RECTIFIER

EGF30DH Parametric

Parameter NameAttribute value
MakerZOWIE Technology Corporation
Reach Compliance Codeunknow
ECCN codeEAR99
EGF30AH THRU EGF30MH
SURFACE MOUNT GLASS PASSIVATED JUNCTION HIGH EFFICIENT RECTIFIER
Reverse Voltage - 50 to 1000 Volts
Forward Current - 3.0 Amperes
ENTED
PAT
0.150(3.80)
0.130(3.30)
SMB/DO-214AA
FEATURES
0.087(2.20)
0.075(1.90)
0.187(4.75)
0.167(4.24)
* Halogen-free type
* GPRC (Glass Passivated Rectifier Chip) inside
* Glass passivated cavity-free junction
* Ideal for surface mount automotive applications
* Superfast recovery time for high efficiency
* Built-in strain relief
* Easy pick and place
0.016(0.40)
0.006(0.15)
0.096(2.43)
0.079(2.00)
0.055(1.40)
0.039(1.0)
0.236(6.00)
0.197(5.00)
* High temperature soldering guaranteed: 260 C/10 seconds,
at terminals
* Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
o
MECHANICAL DATA
Case :
JEDEC DO-214AA molded plastic over passivated chip
Terminals :
Tin plated, solderable per MIL-STD-750,
*Dimensions in inches and (millimeters)
TM
Method 2026
Polarity :
Color band denotes cathode end
Weight :
0.004 ounes , 0.12 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature
SYMBOLS
unless otherwise specified.
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current (SEE FIG.1)
Peak forward surge current 8.3ms single half sine-wave
I
FSM
superimposed on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 3.0 A
Maximum DC reverse current
at rated DC blocking voltage
Maximum reverse recovery time (NOTE 1)
Typical junction capacitance (NOTE 2)
Typical thermal resistance (NOTE 3)
Operating junction and storage temperature range
T
A
=25 C
o
T
A
=125 C
o
T
A
=150 C
o
o
EGF30
AH
50
35
50
BH
100
70
100
DH
200
140
200
GH
400
280
400
JH
600
420
600
KH
800
560
800
MH
1000
700
1000
UNITS
Volts
Volts
Volts
Amps
V
RRM
V
RMS
V
DC
I
(AV)
3.0
115
1.0
5
50
120
50
75
47
12
-65 to +175
1.25
105
1.7
5
120
-
75
Amps
Volts
V
F
I
R
uA
trr
C
J
R
R
JA
JL
nS
pF
o
C/W
o
T
J
,T
STG
C
NOTES : (1) Reverse recovery test condition : I
F
0.5A, I
R
=1.0A, Irr=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas.
REV. 0
Zowie Technology Corporation

EGF30DH Related Products

EGF30DH EGF30AH EGF30GH EGF30JH EGF30KH EGF30MH EGF30BH
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Maker ZOWIE Technology Corporation ZOWIE Technology Corporation ZOWIE Technology Corporation ZOWIE Technology Corporation ZOWIE Technology Corporation ZOWIE Technology Corporation ZOWIE Technology Corporation
Reach Compliance Code unknow unknow unknow unknow unknow unknow unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
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