^E.mi-dondactoi {Piodueti, -Una.
20 STERN AVE.
SPRINGFIELD, NEW JERSEY 07081
U.S.A.
TELEPHONE: (973) 376-2922
(212)227-6005
FAX: (973) 376-8960
IRFM250
POWER MOSFET
THRU-HOLE (TO-254AA)
Features:
Simple Drive Requirements
Ease of Paralleling
Hermetically Sealed
Electrically Isolated
Dynamic dv/dt Rating
Light-weight
Absolute Maximum Ratings
Parameter
l D @ V
G
S = 10V,T
C
= 25
0
C
Units
ID@VGS = IOV,TC = IOO°C
IDM
P
D
@ T
C
= 25°C
VGS
EAS
IAR
EAR
dv/dt
Tj
TSTG
Continuous Drain Current
27.4
A
Continuous Drain Current
17
Pulsed Drain Current 1
110
Max. Power Dissipation
150
W
Linear Derating Factor
1.2
w/°c
Gate-to-Source Voltage
±20
V
Single Pulse Avalanche Energy (?)
500
mJ
Avalanche Current ,1;
27.4
A
Repetitive Avalanche Energy i
15.0
mJ
Peak Diode Recovery dv/dt <D
5.0
V/ns
Operating Junction
-55 to 150
Storage Temperature Range
°C
300 ( 0.063 in. (1.6mm) from case for 10s)
Lead Temperature
Weight
9.3 (Typical)
g
NJ Semi-Conductors reserves the right to change test conditions, parameter limits and package dimensions without
notice. Information furnished b> NJ Semi-Conductors is believed to be both accurate and reliable at the time or'going
to press. However, NJ
Semi-Conductors
assumes no responsibility for any errors or omissions discovered in its use.
\ Semi-Conductors encourages customers to verity that datasheets are current before placing orders.
IRFM250
Electrical Characteristics
@Tj = 25°C (Unless Otherwise Specified)
Parameter
Drain-to-Source Breakdown Voltage
BVDSS
ABVDSS/ATj Temperature Coefficient of Breakdown
Voltage
Static Drain-to-Source On-State
RDS(on)
Resistance
Gate Threshold Voltage
VGS(th)
Forward Transconductance
9fs
Zero Gate Voltage Drain Current
IDSS
Min
200
—
—
—
2.0
90
—
Typ
—
0.28
—
—
—
—
—
Max
Units
—
V
—
0.100
0.105
4.0
—
25
250
100
Test Conditions
VGS = ov, ID = 1 .0mA
Reference to 25°C, ID = 1.0mA
VGS = 10V, ID = 17A ~
VGS = 10V, lo = 27.4A
v/°c
a
V
SM
uA
VDS = VGS. ID = 250|jA
VDS> 15V, IDS = 17A®
VDS= 160V,VGS=OV
VDS = 160V,
VGS = OV, Tj = 125°C
IGSS
IGSS
Qa.
Qgs
Qgd
td(on)
tr
td(off)
tf
LS + LD
Ciss
Coss
Crss
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ('Miller') Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Drain-to-Case Capacitance
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
6.8
-100
115
22
60
35
190
170
130
—
—
—
—
—
nA
VGS = 2ov
VGS = -2ov
VGS=10V, lo = 27.4A
nC
VDS = ioov
VDD = 5ov ID = 44A,
VGS=10V, Rc = 2.35ii
ns
nH
Measured from drain lead (6mm/0.25in. from
package) to source lead (6mm/0.25in . from package
3500
700
110
12
VGS = ov, VDS = 2sv
PF
f = 1.0MHz
CDC
Source-Drain Diode Ratings and Characteristics
Parameter
is
ISM
VSD
trr
QRR
ton
Continuous Source Current (Body Diode)
Pulse Source Current (Body Diode) x
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
Min Typ
—
—
—
—
—
—
—
—
—
—
Max
Units
27.4
110
1.9
950
9.0
Test Conditions
A
V
nS
M
C
Tj = 25°C, Is = 27.4A, VGS = OV ©
Tj = 25°C, IF = 27.4A, di/dt < 100A/U.S
VDD
^
sov ®
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by l_s + LD.
Thermal Resistance
Parameter
RthJC
RthJCS
RthJA
Junction-to-Case
Case-to-Sink
Junction-to-Ambient
Min
Typ
Max
—
—
0.83
—
0.21
—
—
48
Units
°c/w
Test Conditions
Typical socket mount