TELECOM-LINE EQUALIZER, PBGA25
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | National Semiconductor（TI ） |
| package instruction | 3 X 3 MM, MICRO BGA-25 |
| Reach Compliance Code | unknow |
| JESD-30 code | S-PBGA-B25 |
| JESD-609 code | e1 |
| length | 3 mm |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 25 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TFBGA |
| Encapsulate equivalent code | BGA25,5X5,20 |
| Package shape | SQUARE |
| Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.1 mm |
| Maximum slew rate | 0.1 mA |
| Nominal supply voltage | 3.3 V |
| surface mount | YES |
| Telecom integrated circuit types | LINE EQUALIZER |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL |
| Terminal pitch | 0.5 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 40 |
| width | 3 mm |
| LMH0344GR | LMH0344 | LMH0344SQ | LMH0344_09 | |
|---|---|---|---|---|
| Description | TELECOM-LINE EQUALIZER, PBGA25 | TELECOM-LINE EQUALIZER, PBGA25 | TELECOM-LINE EQUALIZER, QCC20 | TELECOM-LINE EQUALIZER, PBGA25 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 25 | 25 | 20 | 25 |
| Maximum operating temperature | 85 °C | 85 Cel | 85 °C | 85 Cel |
| Minimum operating temperature | -40 °C | -40 Cel | -40 °C | -40 Cel |
| surface mount | YES | Yes | YES | Yes |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | BALL | BALL | NO LEAD | BALL |
| Terminal location | BOTTOM | BOTTOM | QUAD | BOTTOM |
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